| AVS 54th International Symposium | |
| Electronic Materials and Processing | Thursday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| EM-ThP1 Electrical Characteristics of Aluminum Oxide Films Deposited by Spray Pyrolysis in the Presence of Ammonia S. Carmona, M. Aguilar-Frutis, CICATA-IPN, Mexico, M. Garcia-Hipolito, J. Guzman, IIM-UNAM, Mexico, C. Falcony, CINVESTAV-IPN, Mexico |
| EM-ThP2 The Influence of Si Content on the Work Function of WSix Gate Electrode C.M. Lin, J.-S. Chen, National Cheng Kung University, Taiwan |
| EM-ThP3 Reduction of Defects at the SiO2/SiC Interface by MeV Electron Beam Irradiation C. Jeon, J.H. Nam, W. Song, D.H. Oh, J.R. Ahn, C.-Y. Park, Sungkyunkwan University, Republic of Korea, M.-C. Jung, H.J. Shin, Pohang Accelerator Laboratory, Republic of Korea, Y.H. Han, B.C. Lee, Korea Atomic Energy Research Institute, Republic of Korea |
| EM-ThP4 Study on Characteristics of ZnO Thin Film by Chemical Mechanical Polishing G.-W. Choi, W.-S. Lee, S.-W. Park, Chosun University, Korea, Y.-J. Seo, Daebul University, Korea, Y.-K. Lee, Chosun University, Korea |
| EM-ThP5 Characterizations of Zn(1-x)Mn(x)O Thin Film Grown by Pulsed Laser Deposition D.-R. Liu, C.-Y. Su, National Applied Research Laboratories, Taiwan |
| EM-ThP6 Effect of Buffer Layer on InN Films Grown by UHV RF-MOMBE W.C. Chen, C.-C. Kei, H.C. Pan, National Applied Research Laboratories, Taiwan, S.Y. Kuo, Chang Gung University, Taiwan, J.S. Chen, C.N. Hsiao, National Applied Research Laboratories, Taiwan |
| EM-ThP7 Preparation and Characterization of HfO2 Thin Films Prepared by Atomic Layer Deposition on Silicon K.T. Kim, G.H. Kim, J.C. Woo, C.I. Kim, Chungang University, Korea |
| EM-ThP8 Characterization of Plasma Etching Induced Interface States at Ti/p-SiGe Schottky Contacts M. Mamor, Sultan Qaboos University, Sultanat of Oman |
| EM-ThP9 DC-to-RF Dispersion Effects in AlGaN/GaN HEMTs Operated Under High Stress P.B. Shah, B. Huebschman, E. Viveiros, K. Kingkeo, A. Hung, K.A. Jones, US Army Research Laboratory |
| EM-ThP10 Ohmic Contacts to n- and p-type GaN Based on TaN, TiN, and ZrN L.F. Voss, L. Stafford, R. Khanna, B.P. Gila, C.R. Abernathy, F. Ren, I.I. Kravchenko, University of Florida |
| EM-ThP11 XPS and LEISS Study of GaAs Surface Preparation using Ammonium Hydroxide F.S. Aguirre-Tostado, M. Milojevic, S.J. McDonnell, R.M. Wallace, University of Texas at Dallas |
| EM-ThP12 Study on Scalability of MTJ Cells Using SPM S. Kim, K. Kim, I. Chung, Sungkyunkwan University, Korea |
| EM-ThP13 The Effect of Synthesis Methods on the Properties of ZnO:Ga Nanoparticle Ceramic Scintillators D.M. DeVito, B. Kensanli, B.L. Armstrong, J.O. Ramey, C.J. Rawn, J.Y. Howe, Oak Ridge National Laboratory, N. Giles, West Virginia University, L.A. Boatner, J.S. Neal, Oak Ridge National Laboratory |
| EM-ThP14 Magnetic Field Dependent Electrical Properties of Vertically Grown Ni Single Nanowire A.-Y. Koo, H. Yang, C.J. Kang, Y.S. Kim, Myongji University, Korea, J.Y. Cho, Korea University, South Korea, Y.J. Choi, Myongji University, Korea, Y.K. Kim, Korea University, South Korea |
| EM-ThP15 Photoluminescence Study of Silicon Nanoclusters Embedded in a SiO2 Matrix Deposited by Reactive Sputtering and Implanted with Si Ions J. Carrillo, G. Garcia, Universidad Autonoma de Puebla, Mexico, M. Melendez, Centro de Investigación y Estudios Avanzados-IPN, Mexico, W. Calleja, Instituto Nacional de Astrofisica, Optica y Electronica, Mexico |
| EM-ThP16 Particle Emission from Zinc Oxide during 193-nm Excimer Laser Irradiation E.H. Khan, S.C. Langford, J.T. Dickinson, Washington State University |
| EM-ThP17 Pentacene TFTs with Ferroelectric Gate Insulators for Non-Volatile Memory Element W. Choi, S.H. Noh, J.M. Choi, D.K. Hwang, S. Im, Yonsei University, Korea |
| EM-ThP18 Flexible Organic Thin Film Transistor using Al2O3-PVP Nano-Composite Gate Dielectrics H.Y. Noh, Y.G. Seol, S.I. Kim, N.-E. Lee, Sungkyunkwan University, Korea |
| EM-ThP19 Fabrication and Characterization of Pentacene Thin Film Transistor with a Polymer Insulator As Gate Dielectric C. Lee, K. Seo, J. Ko, J. Lee, I. Chung, Sungkyunkwan University, Korea |
| EM-ThP20 Differentiating True Tunneling from Defect Dominated One, Using Current-Voltage Curve Fitting A. Vilan, Weizmann Institute of Science, Israel |
| EM-ThP21 Dye Doped Red Organic Light-emitting Diode L. Li, China Aerospace and Technology Corporation No.513 Institute, China |
| EM-ThP22 Photoluminescence Characterization of Polythiophene Films Doped with Highly-Functional Molecules H. Kato, S. Takemura, H. Kobe, Y. Mori, Y. Matsuoka, Y. Watanabe, K. Shimada, T. Hiramatsu, N. Nanba, K. Matsui, Kanto Gakuin University, Japan |
| EM-ThP23 Effect of Water Immersion and Surface Compositional Profile of Photoacid Generator Molecules in Photoresist Materials S. Sambasivan, V.M. Prabhu, D.A Fischer, National Institute of Standards and Technology, L.K. Sundberg, R.D. Allen, IBM Almaden Research Center |
| EM-ThP24 Improvement of Ferroelectric Properties of Pb(Zr,Ti)O3 Thin Film Capacitor Fabricated by Chemical Mechanical Polishing through Post Cleaning Process Y.-K. Jun, P.-G. Jung, P.-J. Ko, Chosun University, Korea, N.-H. Kim, Sungkyunkwan University, Korea, W.-S. Lee, Chosun University, Korea |
| EM-ThP25 Pressure Damage to BLT Thin Film Capacitor Fabricated by Chemical Mechanical Polishing Process P.-G. Jung, Y.-K. Jun, S.-H. Shin, P.-J. Ko, Chosun University, Korea, N.-H. Kim, Sungkyunkwan University, Republic of Korea, W.-S. Lee, Chosun University, Korea |
| EM-ThP26 A Study on the Electrochemical Reaction of Cu Electrode using Linear Sweep Voltammetry (LSV) and Cyclic Voltammetry (CV) Method. Y.-K. Lee, S.-W. Park, S.-J. Han, G.-W. Choi, Chosun University, Korea, Y.-J. Seo, Daebul University, Korea, W.-S. Lee, Chosun University, Korea |
| EM-ThP27 Voltage-Activated Electrochemical Reaction of Cu Electrode for Electrochemical Chemical Mechanical Polishing (ECMP) Application S.-J. Han, S.-W. Park, Y.-K. Lee, G.-W. Choi, Chosun University, Korea, Y.-J. Seo, Daebul University, Korea, W.-S. Lee, Chosun University, Korea |
| EM-ThP28 SEM Image Analysis and Resistance Measurements of Cu Via with Defects on a Test Wafer S. Suzuki, K. Umemura, T. Sunaoshi, Y. Nakano, Hitachi High-Technologies Corporation, Japan |
| EM-ThP29 Aluminum (Al) Contaminants & Copper (Cu) Debris Control in Wire Bonding Process: A Novel Ionization Application O.A. Janducayan, G. Nuneza, Fairchild Semiconductor Inc, Philippines |
| EM-ThP30 Novel Photoresist for Improvement in Pattern Collapse on Silicon Nitride H.-J. Yun, D.-Y. Kim, Y.-G. Kwon, B.-D. Kim, Y.-H. Kim, T.-S. Kim, Y.-B. Koh, Samsung Electronics, Korea |