| AVS 54th International Symposium | |
| Electronic Materials and Processing | Thursday Sessions |
| Session EM-ThP |
| Session: | Electronic Materials and Processing Poster Session |
| Presenter: | O.A. Janducayan, Fairchild Semiconductor Inc, Philippines |
| Authors: | O.A. Janducayan, Fairchild Semiconductor Inc, Philippines G. Nuneza, Fairchild Semiconductor Inc, Philippines |
| Correspondent: | Click to Email |
The effect of ionization is already proven over the years in so many fields and most of the positive effect of this can be manifested in the field of semiconductor. Specific in the wire bonding technology, broken welds are one of the most common failure signature in the industry today and the resolution of this failure varies depending on the failure mechanism. Ionization or the neutralization of static energy during wire bonding of aluminum wires in power packages were proven to have beneficial effects; such effects can be utilize to control metal to metal adhesion in the surrounding environment, i.e. adhesion of conductors through Copper (Cu) contaminants against another metal surface, Aluminum (Al) build up in wedge tools, etc. The neutralization of static energy during the processing of these metals can be effectively utilized to improve overall quality of the process. The framework of this paper presents a study of the beneficial effect of ionization that can contribute in the elimination of broken weld cause by the Aluminum build up and the integration feasibility of ionization application in the original equipment manufacturers Wire Bonding process.