| IUVSTA 15th International Vacuum Congress (IVC-15), AVS 48th International Symposium (AVS-48), 11th International Conference on Solid Surfaces (ICSS-11) | |
| Plasma Science | Tuesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| PS-TuP1 A Comparitive Study of PECVD of Fluorocarbon Films Using C@sub 3@F@sub 8@ and C@sub 4@F@sub 8@ Precursors I.T. Martin, G. Malkov, E.R. Fisher, Colorado State University |
| PS-TuP2 Spectroscopic Study of the Energetic Character of O@sub 2@/Ar/Tetramethyltin Discharge used for the Deposition of Transparent Conductive Tin Oxide Thin Films F. Arefi-Khonsari, N. Bauduin, J. Amouroux, ENSCP-University of P.&M.Curie-Paris-France |
| PS-TuP3 Spatial and Temporal Behaviour of the Plasma Parameters in a Pulsed Magnetron Discharge J.T. Gudmundsson, University of Iceland, J. Alami, U. Helmersson, Linkoping University, Sweden |
| PS-TuP4 Evaluation and Measurement of Ionization Fraction in Ionized Physical Vapor Deposition using Parallel-plates Method K.-F. Chiu, National Tsing Hua University, Taiwan, Z.H. Barber, University of Cambridge, UK, R.E. Somekh, Plasmon Data Systems Ltd., UK |
| PS-TuP5 ICP Source Designs with Azimuthal Field Symmetry Despite a Current Node S. Srinivasan, L.J. Overzet, M. Goeckner, University of Texas at Dallas |
| PS-TuP6 Control of Dissociation by Different Dilution Gases for Plasma Processing KJ Taylor, University of California, San Diego, S.M. Yun, Lam Research Corporation, Y.J. Park, Samsung Electronics Corporation, G.R. Tynan, University of California, San Diego |
| PS-TuP7 Comparative Study of N@sub 2@/CH@sub 4@ Plasmas in Active Discharges and in Flowing Afterglow Conditions R. Hrach, Charles University, Czech Republic, J.C. Legrand, A.M. Diamy, Universite Pierre et Marie Curie, France, V. Hrachova, M. Vicher, Charles University, Czech Republic |
| PS-TuP8 Diagnostics and Modelling of Ar/O@sub 2@ Plasma used for Plasma Oxidation of Al J. Pavlik, S. Novak, Z. Stryhal, J. E. Purkyne University, Czech Republic, R. Hrach, V. Hrachova, M. Vicher, Charles University, Czech Republic |
| PS-TuP9 Simulation of High Aspect Ratio Trench Profiles in Silicon under a SF@sub 6@/O@sub 2@ Plasma Chemistry by a 2D Surface Model Based on Monte-Carlo Techniques G. Marcos, GREMI, CNRS-Universite d'Orleans, France, A. Rhallabi, LPCM, IMN, CNRS-Universite de Nantes, France, P. Ranson, GREMI, CNRS-Universite d'Orleans, France |
| PS-TuP10 Scalability of Innovative ICP Source Geometries L.J. Pratti, J.M. Marquis, M. Goeckner, L.J. Overzet, University of Texas at Dallas |
| PS-TuP11 Study of Pulsed Plasma Doping by Experimental Diagnostics and HPEM Simulations Y. Lei, E.A. Oakes, M. Goeckner, University of Texas at Dallas, S.B. Felch, Z. Fang, B.-W. Koo, Varian Semiconductor Equipment Associates |
| PS-TuP12 Neutral Gas Pressure and Flow in High Density Plasmas M.A. Nierode, D.B. Graves, University of California at Berkeley |
| PS-TuP14 Numerical Optimization of a C@sub 4@F@sub 8@ Chamber Clean Recipe G.I. Font, Kinema Research, B. Devulapalli, Fluent, Inc., W.L. Morgan, Kinema Research |
| PS-TuP16 Computer Modeling as a Tool to Design Non-Critical High Rate Deposition Conditions for the "Baffled Target" Reactive Sputtering Process T. Nyberg, F. Engelmark, J. Westlinder, S. Berg, Uppsala University, Sweden |
| PS-TuP17 Influence of High Power Densities on the Composition of Pulsed Magnetron Plasmas A.P. Ehiasarian, K.M. Macak, R. New, W.-D. Münz, Sheffield-Hallam University, UK, U. Helmersson, Linköping University, Sweden |
| PS-TuP20 Self-consistent Particle Modelling of Plasma-solid Interaction: Sheath Formation in Electronegative Plasma R. Hrach, V. Hrachova, M. Vicher, Charles University, Czech Republic |
| PS-TuP21 A New Protective Layer Using Plasma Polymerized Thin Films in Plasma Display Panel S.O. Kim, G.H. Miley, University of Illinois at Urbana-Champaign |
| PS-TuP22 Synthesis of Organic Polymer Thin Films by Plasma Assisted CVD for Low k Dielectrics Application M.-C. Kim, S.-H. Cho, J.G. Han, S.-B. Lee, J.-H. Boo, Sungkyunkwan University, Korea |
| PS-TuP23 Improved Gas-mixtures for High Efficiency in AC Plasma Display Panel M.-P. Park, T.-W Kim, H.-J. Hwang, Chung-Ang University, Korea |
| PS-TuP24 The Effect of Washing Treatments on the Surface Chemistry of Plasma Coated Textiles as Studied by High Resolution XPS S.R. Coulson, Dera, UK, S.J. Hutton, C. Moffitt, Kratos Analytical, UK |
| PS-TuP25 Surface Reactions of Polyethylene with Nitrogen Plasmas/Ion Beams A.J. Wagner, S.R. Carlo, C. Vecitis, Johns Hopkins University, F. Reniers, Universite Libre de Bruxelles, Belgium, H. Fairbrother, Johns Hopkins University |
| PS-TuP26 Plasma, Electrochemical and Thermal Oxidations of Metals and Alloys as Methods for Designing Nanostructured Oxide Films J.R. Parga, Instituto Tec. de Saltillo, Mexico, M.A. Hossain, Lamar University, H. McWhinney, Prairie View A&M University, D. Mencer, Penn State University, D.L. Cocke, Lamar University |
| PS-TuP27 Change of Surfaces of PDP Panel during Discharge K.H. Lee, H. Soh, Y.C. Kim, Hanyang University, Korea |
| PS-TuP28 Characteristics of Capillary Electrode Atmospheric Pressure Glow Discharge and Its Application to Glass Substrate Cleaning Y.H. Lee, C.H. Yi, M.J. Chung, G.Y. Yeom, Sungkyunkwan University, Korea |
| PS-TuP29 The Relationship between Plasma States and Film Formation Behavior in Ti-Me-N by Double Magnetron Sputtering Y.M. Kim, J. Kim, J.G. Han, Sungkyunkwan University, Korea |
| PS-TuP30 Amorphous Metal-organic Chemical Vapor Deposition Nb@sub x@Ta@sub (1-x)@N Films for Diffusion Barrier W.C. Gau, C.W. Wu, National Tsing Hua University, Taiwan, R.O.C., T.C. Chang, National Sun Yat-Sen University, Taiwan, R.O.C., C.H. Li, National Chiao Tung University, Taiwan, R.O.C., C.J. Chu, C.H. Chen, Nanmat Technology Co., LTD., Taiwan, R.O.C., L.J. Chen, National Tsing Hua University, Taiwan, R.O.C. |
| PS-TuP31 Silicon Trench Oxidation Layer Formation by Employing Oxygen Negative Ion H. Shindo, Tokai University, Japan |
| PS-TuP32 Surface Coating of Poly(meta-phenylene isophthalamide) Nanofibers by Chemical Vapor Deposition and Metal Sputtering M. Graham, W. Liu, D. Reneker, E.A. Evans, University of Akron |