| AVS 63rd International Symposium & Exhibition | |
| Plasma Science and Technology | Thursday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| PS-ThP1 RF Assisted Reactive High Power Impulse Magnetron Sputtering Deposition of Titanium Nitride Thin Film for Plasmonic Applications Ru-Jing Sun, National Tsing Hua University, Taiwan, Republic of China, B.H. Liao, C.-N. Hsiao, Instrument Technology Research Center, Taiwan, Republic of China, K.C. Leou, National Tsing Hua University, Taiwan, Republic of China |
| PS-ThP2 Transport Line for Laser Multicharged Ion Implantation and Deposition System MdHaider Shaim, M.M. Rahman, O. Balki, Old Dominion University, A. Sarkissian, Plasmionic Technologies, M.L. Korwin-Pawlowski, University Du Quebec en outaouais, Canada, H.E. Elsayed-Ali, Old Dominion University |
| PS-ThP5 Optimizing Process Parameters for Plasma Assisted Atomic Layer Epitaxy (PA-ALE) of Nitrides Virginia Anderson, D.R. Boris, N. Nepal, S.D. Johnson, A.C. Kozen, Naval Research Laboratory, Z. Robinson, Boston University, S.C. Hernandez, C.R. Eddy, Jr., S.G. Walton, Naval Research Laboratory |
| PS-ThP6 Plasma Treatment of Plated Surfaces Christopher Fields, M.J. Buie, Coherent Inc |
| PS-ThP7 Customizing Arrays of Microplasmas for Controlling Properties of Electromagnetic Waves Chenhui Qu, P. Tian, M.J. Kushner, University of Michigan |
| PS-ThP8 Optical Emission Diagnostics of a Non-equilibrium Helium Plasma Jet at 1 Atm in Ambient Air Tam Nguyen, E. Hernández, D.J. Economou, V.M. Donnelly, University of Houston |
| PS-ThP9 Etching Capability of Silicon Nitride using a Low Electron Temperature Plasma Source Hiroyuki Miyazoe, A.V. Jagtiani, S.U. Engelmann, IBM T.J. Watson Research Center, D.R. Boris, S.C. Hernández, E.H. Lock, S.G. Walton, Naval Research Laboratory, E.A. Joseph, IBM T.J. Watson Research Center |
| PS-ThP10 Deep GaAs Etching with V-shaped Trench Profile Using Inductively Coupled Plasma Technology T. Sugahara, SAMCO Inc., Japan, Shogo Uehara, SAMCO Inc., M. Hiramoto, SAMCO Inc., Japan |
| PS-ThP12 Ion Beam Etch Process Optimization for the Patterning of High Density STTRAM Pillars Vincent Ip, Veeco, S. Huang, Lam Research Corporation, S.D. Carnevale, Veeco, I.L. Berry, Lam Research Corporation, K. Rook, Veeco, T.B. Lill, Lam Research Corporation, A.P. Paranjpe, F. Cerio, Veeco |
| PS-ThP13 Down Stream Plasma Ash Process Impact on Metal Electrode Oxidation and Nitridation for 10nm and Below Logic Technology B. Elliston, G. Kishko, V. Vaniapura, V.P. Nagorny, Shawming Ma, Mattson Technology |
| PS-ThP14 Atomic Layer Etching of Conventional and 2D Materials Mike Cooke, A.L. Goodyear, R. Sundaram, B. Halsall, Oxford Instruments Plasma Technology, UK |
| PS-ThP15 Rapid In Situ H Plasma Carbon and Oxygen Cleaning of In0.53Ga0.47As(001) and Si0.5Ge0.5(110) S. Wolf, M. Edmonds, University of California at San Diego, X. Jiang, PIE Scientific, R. Droopad, Texas State University, N. Yoshida, L. Dong, Applied Materials, R. Galatage, S. Siddiqui, B. Sahu, GLOBALFOUNDRIES, A.C. Kummel, University of California at San Diego, Mahmut Kavrik, University of California San Diego |
| PS-ThP17 Backside Via Last Process Technologies for Wafer Level 3D Stacking. Toshiyuki Sakuishi, T. Murayama, Y. Morikawa, ULVAC Inc., Japan |
| PS-ThP18 New Deep SiO2 Etching Process Issues for Silicon Photonics Device Fabrications Keizo Kinoshita, PETRA, Japan, M. Noguchi, PETRA, T. Horikawa, AIST, T. Nakamura, T. Mogami, PETRA |
| PS-ThP20 Modeling of Remote Plasma Sources using CFD-ACE+ Abhra Roy, P. Shukla, K. Jain, A.N. Bhoj, ESI US R&D Inc. |
| PS-ThP21 Controllable Deposition of TiO2 Films by Atmospheric Pressure Dielectric Barrier Discharge: Gas Composition Effect and Mechanism Qianqian Chen, A. Ozkan, S. Collette, J. Mertens, J. Baneton, M.P. Delplancke, F. Reniers, Université Libre de Bruxelles, Belgium |
| PS-ThP22 Synthesis of Acrylate Coatings with Tunable and Permanent Wettability by Atmospheric Plasma B. Nisol, J. Guesquière, Delphine Merche, N. Vandencasteele, F. Reniers, Université Libre de Bruxelles, Belgium |
| PS-ThP23 A High-flux Low-energy Hydrogen Ion Beam Using an end-Hall Ion Source Jacqueline van Veldhoven, E. te Sligte, J.P.B. Janssen, TNO Technical Sciences, Netherlands, I. Ament, Carl Zeiss SMT GmbH, Germany |
| PS-ThP24 A System of Radical Probes for Plasma Characterization Dren Qerimi, University of Illinois at Urbana-Champaign, I.A. Shchelkanov, University of Illinois at Urbana Champaign, D.N. Ruzic, University of Illinois at Urbana-Champaign |
| PS-ThP25 Using Optical Emission and Broadband Absorption Spectroscopy to Elucidate Energy Partitioning Trends Within Inductively Coupled Plasma Systems Angela Hanna, J.M. Blechle, E.R. Fisher, Colorado State University |
| PS-ThP27 Modeling of Electron Kinetics in rf Discharges at Low and High Pressures Ananth Bhoj, Z.A. Xiong, ESI US R&D Inc., V.I. Kolobov, CFD Research Corporation |
| PS-ThP29 Nanoparticle Synthesis via a High Voltage Pulsed DC Atmospheric-Pressure Microplasma Jet Steven Doyle, K.G. Xu, University of Alabama in Huntsville |
| PS-ThP30 Extending the Volume and Processing Area of Atmospheric Pressure Plasma Jets Eric Gillman, D.R. Boris, M.H. Helle, S.C. Hernández, Tz.B. Petrova, G.M. Petrov, S.G. Walton, Naval Research Laboratory |
| PS-ThP31 Characteristics of Cutoff Probe for Magnetized Plasma Measurement Jung-Hyung Kim, Korea Research Institute of Standards and Science, Republic of Korea, K.H. You, Korea Research Institute of Standards and Science, S.J. You, Chungnam National University, H.C. Lee, D.J. Seong, Korea Research Institute of Standards and Science |
| PS-ThP32 Development of the Gas Cherenkov Detector (GCD-3) and the Unique Engineering Challenges Associated with the ASME Boiler and Pressure Vessel Code Frank Lopez, H.W. Herrmann, J.A. Oertel, S.H. Batha, Y.H. Kim, J.R. Griego, T.N. Archuleta, R.J. Aragonez, V.E. Fatherley, C.S. Young, A. Hsu, R.M. Malone, Los Alamos National Laboratory |
| PS-ThP33 Magnetic Tunnel Junctions Etch and Encapsulation Process Optimization for High-Density STT-MRAM Applications Laurent Souriau, D. Radisic, S. Kundu, V. Paraschiv, imec, Belgium, F. Yamashita, K. Fujimoto, S. Tahara, K. Maeda, TEL, Japan, W. Kim, S. Rao, G. Donadio, D. Crotti, D. Tsvetanova, J. Swerts, S. Mertens, T. Lin, S. Couet, D. Piumi, G.S. Kar, A. Furnemont, imec, Belgium |
| PS-ThP34 Effect of High DC Bias on Silicon Oxide Coatings Deposited by Plasma Enhanced Chemical Vapor Deposition Norihiro Jiko, Kobe Steel, Ltd., Japan, A. Narai, Kobe Steel, Ltd., N. Kawakami, T. Okimoto, Kobe Steel, Ltd., Japan |