| AVS 53rd International Symposium | |
| Plasma Science and Technology | Monday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:00am | PS2-MoM1 Plasma Etch Challenges in Non-Planar Device Fabrication U. Shah, R.B. Turkot, Jr, T. Ghosh, S. Shankar, Intel Corporation |
| 8:20am | PS2-MoM2 Effect of Photoresist Trimming and Plasma Treatments on Line Roughness, Necking, and Bending During High Density Plasma Polysilicon Gate Etching S.A. Vitale, B.A. Smith, J.W. Blatchford, B.M. Rathsack, Texas Instruments |
| 8:40am | PS2-MoM3 Understanding the Impact of Chamber Walls during Plasma Etching: a Key to Control Plasma Processes In ULSI R. Ramos, Freescale Semiconductor, France, G. Cunge, O. Joubert, Laboratoire des Technologies de la Microelectronique, CNRS-LTM, France, M. Orlowski, Freescale Semiconductor, France, T. Lill, Applied Materials |
| 9:00am | PS2-MoM4 Effect of Etching Process on Gate LER A. Yabata, O. Koike, J. Hashimoto, I. Kurachi, Miyagi Oki Electric Co., Ltd., Japan |
| 9:20am | PS2-MoM5 Plasma Atomic Layer Etching Using Conventional Plasma Equipment* A. Agarwal, University of Illinois at Urbana-Champaign, M.J. Kushner, Iowa State University |
| 9:40am | PS2-MoM6 Impact of Plasma Damage on Cobalt Silicidation T. Kimura, K. Kugimiya, K. Fuke, T. Ohchi, T. Kataoka, T. Tatsumi, Y. Kamide, Sony Corporation, Japan |
| 10:20am | PS2-MoM8 Invited Paper Plasma Etching Challenges of New Materials Involved in Gate Stack Patterning for sub 45 nm Technological Nodes O. Joubert, CNRS-LTM-France, A. Le Gouil, STM-France, R. Ramos, CNRS-LTM-France, M. Helot, STM-France, O. Luere, E. Richard, G. Cunge, T. Chevolleau, E. Pargon, L. Vallier, CNRS-LTM-France, T. Morel, S. Barnola, CEA-LETI-France, T. Lill, J.P. Holland, A. Patterson, AMAT-USA |
| 11:00am | PS2-MoM10 Ta and Mo-based Metal Etch for Advanced Gate Stacks E. Luckowski, A. Martinez, S. Rauf, Freescale Semiconductor, Inc. |
| 11:20am | PS2-MoM11 Influence of Stopping Layer Nature on Poly-Si/Metal Gate Patterning Process V. Paraschiv, D. Shamiryan, M. Demand, S. Beckx, IMEC, Belgium, C.G.N. Lee, G. Kota, LAM Research, W. Boullart, IMEC, Belgium |
| 11:40am | PS2-MoM12 Plasma Etching of Tungsten Nitride for sub 45nm Metal Gate S. Barnola, CEA-LETI/France, T. Morel, STMicroelectronics |