| AVS 62nd International Symposium & Exhibition | |
| Plasma Science and Technology | Thursday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| PS-ThP1 Effect of Embedded Radio Frequency Pulsing for Selective Etching of SiO2 Contact Hole using Ar/C4F8/O2 Gas Mixture in the 60/2 MHz Dual-frequency Capacitively Coupled Plasma System Namhun Kim, Samsung Electronics, Republic of Korea, G.Y. Yeom, Sungkyunkwan University, Republic of Korea |
| PS-ThP2 Synthesis of B4C And In Situ B4C / ZrB2 From Sugar Based Precursor Abdullah Selim Parlakyigit, E. Aktan, C. Ergun, Istanbul Technical University, Turkey |
| PS-ThP3 High Power Pulsed Magnetron Sputtering: A Way to Broaden Industrial Implementation Jake McLain, P. Raman, I.A. Shchelkanov, Center for Plasma Material Interactions, University of Illinois, USA, S. Armstrong, Kurt J. Lesker Company, D.N. Ruzic, Center for Plasma Material Interactions, University of Illinois, USA |
| PS-ThP4 Non-thermal Plasma Synthesis of Hollow Silicon Carbide Nanoparticles Devin Coleman, T. Lopez, O. Yasar-Inceolgu, L. Mangolini, University of California - Riverside |
| PS-ThP5 Finite Element Modeling of Surface Wave Plasmas Excited by Microwave Slot Antennas for Processing of Thin Film Materials Pawel Piotrowicz, University of Illinois, D. Alman, B. Jurczyk, Starfire Industries, M. Stowell, Applied Materials, I. Schelkanov, University of Illinois, D. Curreli, University of Illinois at Urbana Champaign, D.N. Ruzic, University of Illinois |
| PS-ThP6 Instantaneous Generation of Many Flaked Particles in Mass-Production Plasma Etching Equipment Yuji Kasashima, National Institute of Advanced Industrial Science and Technology (AIST), Japan |
| PS-ThP7 Plasma Chemical Transport of Borazine for 2D Atomic Layer Growth of Hexagonal Boron Nitride Takeshi Kitajima, T. Nakano, National Defense Academy of Japan |
| PS-ThP9 A Low Cost Microplasma Generation Device for Detection of Volatile Organic Compounds Using Plasma Emission Spectroscopy Po-Wei Ye, C.C. Hsu, National Taiwan University, Taiwan, Republic of China |
| PS-ThP10 The Development of a Pin-to-Droplet Plasma Generation Device for Detection of Metallic Ions in Aqueous Solutions Min-Chun Chen, C.C. Hsu, National Taiwan University, Taiwan, Republic of China |
| PS-ThP12 Simulation of Deep Silicon Etching under Cryogenic ICP SF6/O2/Ar Plasma Mixture using multi-Scale Approach Y. Haidar, Ahmed Rhallabi, A. Pateau, A. Mokrani, Université de Nantes, France, F. Taher, Université Libanaise, Lebanon |
| PS-ThP13 Two Dimentional Visualization of Oxidation Effect of Scalable DBD Plasma Irradiation using KI-starch Solution K. Koga, T. Amano, Thapanut Sarinont, Kyushu University, Japan, T. Kawasaki, Nippon Bunri University, Japan, G. Uchida, Osaka University, Japan, H. Seo, N. Itagaki, M. Shiratani, Y. Nakatsu, A. Tanaka, Kyushu University, Japan |
| PS-ThP14 Sensitivity Enhancement of RF Plasma Etch Endpoint Detection With K-means Cluster Analysis Honyoung Lee, H. Jang, H. Lee, H. Chae, Sungkyunkwan University, Republic of Korea |
| PS-ThP15 The Study on the Etching Characteristics of the High Aspect Ratio Amorphous Carbon Layer(ACL) Yonghyun Kwon, Z.H. Gang, K.S. Shin, Samsung Electronics Co., LTD., Republic of Korea, G.Y. Yeom, Sungkyunkwan University, Republic of Korea |
| PS-ThP16 Carbon Dioxide and Methane Conversion Using Low Cost Microplasma Generation Devices Yu-Hsin Huang, C.C. Hsu, C.M. Wang, National Taiwan University, Taiwan, Republic of China |
| PS-ThP17 A MEMS Approach to Making Quantitative Measurements of IIEE Yields in the Presence of Moderate Electric Fields Keith Hernandez, A. Press, D. Urrabazo, M.J. Goeckner, L.J. Overzet, University of Texas at Dallas |
| PS-ThP18 Spectroscopic Investigation of Hydrocarbon Plasmas for Coating Applications Sarah Siepa, Ruhr-University Bochum, Germany, S. Grosse, M. Guenther, Robert Bosch GmbH, Germany, A. von Keudell, Ruhr-University Bochum, Germany |
| PS-ThP19 From Plasma Reactor to Surface Level: Linking Plasma with Feature Profile Simulations Sebastian Mohr, A. Dzarasova, Quantemol Ltd., UK, D. Tsamados, V. Deshpande, M. Oulmane, Synopsys LLC, Switzerland, J. Tennyson, University College London, UK |
| PS-ThP20 Atomic Layer Etching of SiO2 Using Self-Limited Fluorocarbon Films Sanbir Kaler, Q. Lou, V.M. Donnelly, J. Economou, University of Houston |
| PS-ThP21 Amorphous Hydrogenated Boron Carbide: A New Color in the Materials Palette for Multiple Patterning M.M. Paquette, Bradley Nordell, T.D. Nguyen, S. Dhungana, A.N. Caruso, University of Missouri-Kansas City, W.A. Lanford, University at Albany-SUNY, P. Henry, S.W. King, Intel Corporation |
| PS-ThP22 Properties of a Magnetic Neutral-Loop Discharge Plasma Weiyi Li, S. Kim, J. Blatz, University of Wisconsin-Madison, Y. Nishi, Stanford University, J.L. Shohet, University of Wisconsin-Madison |
| PS-ThP23 Impact of Charge Separation Grid Design on Wafer Level Device Performance in an Advanced Plasma Asher H-A. Phan-Vu, Shawming Ma, Mattson Technology |
| PS-ThP24 Fluorophore based Sensor for Oxygen Radicals in Processing Plasmas F. Choudhury, G. Sabat, M. Sussman, University of Wisconsin-Madison, Y. Nishi, Stanford University, J. Leon Shohet, University of Wisconsin-Madison |
| PS-ThP26 Capacitively Coupled Indirect Plasma Discharge - 2 Dimensional Fluid Model Simulation Study Pei-Siou Luo, T.Y. Chang, National Tsing Hua University, K.C. Leou, National Tsing Hua University, Taiwan, Republic of China |
| PS-ThP27 Plasma Simulations with Adaptive Mesh Refinement and Hybrid Kinetic-Fluid Models Vladimir Kolobov, R.R. Arslanbekov, CFD Research Corporation |
| PS-ThP28 Meshed Shielding Grid Added Electron Beam Excited Plasma Apparatus for Neutral Nitriding of Precision Components Petros Abraha, Meijo University, Japan |
| PS-ThP29 Deposition of Silicon Nitride Coatings by Pulser Laser Deposition Technique Johans Restrepo, Universidad Nacional Autonoma de Mexico, E. Camps, Instituto Nacional De Investigaciones Nucleares, Mexico, S. Muhl, Universidad Nacional Autonoma de Mexico |