AVS 59th Annual International Symposium and Exhibition | |
Plasma Science and Technology | Tuesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
8:00am | PS2-TuM1 Gate-Silicon Etching using Evanescent Microwave Plasma for 22nm Technology Node and Beyond A. Ranjan, S. Voronin, H. Kintaka, K. Kumar, P. Biolsi, Tokyo Electron Technology Center, America, LLC, R. Jung, S. Kanakasabapathy, International Business Machines – Research Group, A. Banik, IBM T.J. Watson Research Center |
8:20am | PS2-TuM2 Tracking Line Width Roughness Improvement during Gate Plasma Patterning L. Vallier, E. Pargon, CNRS, France, N. Posseme, CEA, LETI, MINATEC Campus, France, L. Azarnouche, CNRS, France, S.D. Nemani, C. Rosslee, T. Pham, Applied Materials Inc. |
8:40am | PS2-TuM3 Invited Paper Plasma Prize Talk: Grand Challenges in Etch R. Gottscho, S. Sriraman, Lam Research |
9:20am | PS2-TuM5 Spacer Patterning for Trigate SOI Devices S. Barnola, P. Pimenta-Barros, L. Desvoivres, J. Pradelles, S. Barraud, CEA, LETI, MINATEC Campus, France |
9:40am | PS2-TuM6 Key Challenges in FinFET FEOL RIE Processing at the 14nm CMOS Node and Beyond R.M. Martin, A. Banik, J. Chang, R. Jung, S. Kanakasabapathy, M. Kobayashi, Q. Lin, B.G. Morris, S.C. Seo, T. Standaert, K. Stein, R. Sreenivasan, H. Wang, M. Yang, Q. Yang, Y. Yin, IBM Corporation, D.H. Choi, R. Kambhampati, T. Kwon, GLOBALFOUNDRIES |
10:40am | PS2-TuM9 Patterning Options for 14nm Node and Beyond Y. Yin, R. Jung, F. Lie, M. Beard, B.G. Morris, M. Hartig, S. Kanakasabapathy, IBM Res. at Albany Nanotech, Y. Mignot, STMicroelectronics, Y. Xu, C. Koay, IBM Res. at Albany Nanotech, L. Jang, GLOBALFOUNDRIES, N. Saulnier, J. Abdallah, H. Chen, IBM Res. at Albany Nanotech, M. Tagami, Renesas Electonics, K. Akarvardar, S. Akarvardar, GLOBALFOUNDRIES, J. Arnold, T. Spooner, M. Colburn, IBM Res. at Albany Nanotech |
11:00am | PS2-TuM10 High-Efficiency Downstream Plasma Processes L. Diao, R. Elliston, A. Kadavanich, C. Lee, V. Nagorny, H. PhanVu, O. Todor, V. Vaniapura, Mattson Technology |
11:20am | PS2-TuM11 Challenges for Sub 20nm STI Etch H. Zhou, X. Ji, S. Srinivasan, J. He, X. Hua, D. Heo, J. Choi, A. Khan, A. Agarwal, S. Rauf, Applied Materials Inc. |