AVS 59th Annual International Symposium and Exhibition
    Plasma Science and Technology Tuesday Sessions

Session PS2-TuM
Advanced FEOL/Gate Etching 2

Tuesday, October 30, 2012, 8:00 am, Room 25
Moderator: J.P. Chang, University of California at Los Angeles


  Click here to Download program book for this session  
  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

8:00am PS2-TuM1
Gate-Silicon Etching using Evanescent Microwave Plasma for 22nm Technology Node and Beyond
A. Ranjan, S. Voronin, H. Kintaka, K. Kumar, P. Biolsi, Tokyo Electron Technology Center, America, LLC, R. Jung, S. Kanakasabapathy, International Business Machines – Research Group, A. Banik, IBM T.J. Watson Research Center
8:20am PS2-TuM2
Tracking Line Width Roughness Improvement during Gate Plasma Patterning
L. Vallier, E. Pargon, CNRS, France, N. Posseme, CEA, LETI, MINATEC Campus, France, L. Azarnouche, CNRS, France, S.D. Nemani, C. Rosslee, T. Pham, Applied Materials Inc.
8:40am PS2-TuM3 Invited Paper
Plasma Prize Talk: Grand Challenges in Etch
R. Gottscho, S. Sriraman, Lam Research
9:20am PS2-TuM5
Spacer Patterning for Trigate SOI Devices
S. Barnola, P. Pimenta-Barros, L. Desvoivres, J. Pradelles, S. Barraud, CEA, LETI, MINATEC Campus, France
9:40am PS2-TuM6
Key Challenges in FinFET FEOL RIE Processing at the 14nm CMOS Node and Beyond
R.M. Martin, A. Banik, J. Chang, R. Jung, S. Kanakasabapathy, M. Kobayashi, Q. Lin, B.G. Morris, S.C. Seo, T. Standaert, K. Stein, R. Sreenivasan, H. Wang, M. Yang, Q. Yang, Y. Yin, IBM Corporation, D.H. Choi, R. Kambhampati, T. Kwon, GLOBALFOUNDRIES
10:40am PS2-TuM9
Patterning Options for 14nm Node and Beyond
Y. Yin, R. Jung, F. Lie, M. Beard, B.G. Morris, M. Hartig, S. Kanakasabapathy, IBM Res. at Albany Nanotech, Y. Mignot, STMicroelectronics, Y. Xu, C. Koay, IBM Res. at Albany Nanotech, L. Jang, GLOBALFOUNDRIES, N. Saulnier, J. Abdallah, H. Chen, IBM Res. at Albany Nanotech, M. Tagami, Renesas Electonics, K. Akarvardar, S. Akarvardar, GLOBALFOUNDRIES, J. Arnold, T. Spooner, M. Colburn, IBM Res. at Albany Nanotech
11:00am PS2-TuM10
High-Efficiency Downstream Plasma Processes
L. Diao, R. Elliston, A. Kadavanich, C. Lee, V. Nagorny, H. PhanVu, O. Todor, V. Vaniapura, Mattson Technology
11:20am PS2-TuM11
Challenges for Sub 20nm STI Etch
H. Zhou, X. Ji, S. Srinivasan, J. He, X. Hua, D. Heo, J. Choi, A. Khan, A. Agarwal, S. Rauf, Applied Materials Inc.