| AVS 51st International Symposium | |
| Manufacturing Science and Technology | Wednesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:20am | MS-WeM1 Invited Paper Integration Challenges for 45nm Strained Si Devices M. Sadaka, A. Thean, A. Barr, T. White, B. Nguyen, V. Vartanian, M. Zavala, D. Eades, S. Zollner, Q. Xie, X. Wang, R. Liu, M. Kottke, Freescale Semiconductor |
| 9:00am | MS-WeM3 Invited Paper 45nm Node Architecture: The Driving Force of the Ion Implantation and Activation Processes Challenges D. Lenoble, STMicroelectronics |
| 9:40am | MS-WeM5 Invited Paper Taking SOI and Low-k Dielectrics Into 130nm and 90nm High-Volume Microprocessor Production: Challenges, Processes, Extendibility R. Stephan, D. Greenlaw, G. Burbach, T. Feudel, F. Feustel, K. Frohberg, F. Graetsch, G. Grasshoff, C. Hartig, T. Heller, K. Hempel, M. Horstmann, P. Huebler, R. Kirsch, S. Kruegel, E. Langer, K. Romero, H. Ruelke, H. Schuehrer, A. Wei, T. Werner, K. Wieczorek, Advanced Micro Devices, AMD Saxony LLC, Germany |
| 10:20am | MS-WeM7 Invited Paper Beyond Planar Bulk CMOS: Manufacturing Issues in the 3rd Dimension C.R. Cleavelin, Texas Instruments |
| 11:00am | MS-WeM9 Invited Paper The Nanotechnology Research Institute G. Bourianoff, Intel Corp. |