AVS 50th International Symposium
    Plasma Science and Technology Wednesday Sessions

Session PS-WeP
Poster Session

Wednesday, November 5, 2003, 11:00 am, Room Hall A-C


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  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

PS-WeP1
Experiemental Study of Real-Time Feedback Control of Ion Energy and Ion flux in Poly-Si Etch Process Using High Density Cl@sub 2@ Plasmas
K.C. Leou, C.H. Chang, C. Lin, National Tsing Hua University, ROC
PS-WeP3
Study of the Passivation Mechanisms Involved in the Silicon Deep Etching Cryogenic Process
X. Mellhaoui, R. Dussart, A. Basillais, T. Tillocher, P. Lefaucheux, P. Ranson, GREMI, France
PS-WeP4
Etching Characteristics in Novel Internal Linear Inductively Coupled Plasma Antenna for Flat Panel Display Applications
G.Y. Yeom, K.N. Kim, Y.J. Lee, Sung Kyun Kwan University, South Korea, B.U. Cho, J.K. Lee, Pohang University Science and Technology, Korea, M.A. Lieberman, University of California at Berkeley
PS-WeP6
Inductively Coupled Plasmas in Cl@sub 2@/O@sub 2@ Mixtures: Modeling and Experiment
A.M. Efremov, Ivanovo State University of Chemistry and Technology, Russia, C.I. Kim, D.P. Kim, Chung-Ang University, Korea
PS-WeP8
Atomic Layer Etching of Silicon using a Low Angle Forward Reflected Ar Neutral Beam
S.D. Park, D.H. Lee, G.Y. Yeom, Sungkyunkwan University, Korea
PS-WeP9
Molecular Beam Mass Spectrometry of the Microwave Discharge in Methane/Argon Gas Mixture
M. Misina, P. Pokorny, Institute of Physics ASCR, Czech Republic
PS-WeP10
Spatio-temporal Characterization of Pulsed, Electron Beam Produced Plasmas
S.G. Walton, D. Leonhardt, C. Muratore, D.D. Blackwell, R.F. Fernsler, R.A. Meger, Naval Research Laboratory
PS-WeP11
Experimental Characterization of a Pulsed Inductively Coupled Plasma
C.H. Chang, K.C. Leou, S.J. Wu, M.L. Gong, T.L. Lin, National Tsing Hua University, ROC
PS-WeP12
Effect of Gas Heating in a High Density Pulsed Plasma Discharge
D.J. Economou, S.K. Nam, University of Houston
PS-WeP13
A Model of Feature Profile Evolution for Nanometer-Scale Control of Etched Profiles and Critical Dimensions
K. Ono, Y. Osano, A. Sano, K. Takahashi, Y. Setsuhara, Kyoto University, Japan
PS-WeP14
Selected Modifications of PE and PTFE Surfaces by Means of a Modified RF N@sub 2@ Plasma
N. Vandencasteele, F. Reniers, Universite Libre de Bruxelles, Belgium
PS-WeP15
Principle of a Beam Profile Controlled Linear Ion Beam Source and Application Examples
M. Nestler, D. Roth, Roth & Rau AG, Germany, F Scholze, M. Tartz, Institut f@um u@r Oberfl@um a@chenmodifizierung Leipzig e.V., Germany, M. Zeuner, Ion+Tech GmbH, Germany, H. Neumann, Institut f@um u@r Oberfl@um a@chenmodifizierung Leipzig e.V., Germany
PS-WeP16
Creation and Characteristics of Miniature Microwave Plasmas
J. Narendra, T.A. Grotjohn, J. Asmussen, Michigan State University
PS-WeP17
Laboratory Exercises for a Technician-Level Course in Plasma-Aided Manufacturing
D.M. Hata, Portland Community College