AVS 50th International Symposium
    Manufacturing Science and Technology Monday Sessions

Session MS-MoM
Process and Equipment Integration and Development

Monday, November 3, 2003, 8:20 am, Room 309
Moderator: E.G. Seebauer, University of Illinois at Urbana Champaign


  Click here to Download program book for this session  
  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

8:40am MS-MoM2
Development of Low Resistance Copper Thin Films Using a Strain Enhanced Grain Growth Technique
M. Moriyama, M. Shimada, H. Masuda, M. Murakami, Kyoto University, Japan
9:00am MS-MoM3
Processing and Characterization of PMSSQ Based Materials for Nanoporous Low-K Dielectrics
P. Lazzeri, ITC-IRST, Italy, J.J. Park, Z. Lin, R.M. Briber, University of Maryland, L. Vanzetti, M. Anderle, M. Bersani, ITC-IRST, Italy, R.D. Miller, IBM Almaden Research Center, G.W. Rubloff, University of Maryland
9:20am MS-MoM4
Multi-scale Modeling of Chemical Mechanical Planarization
L. Jiang, H. Simka, S. Skokov, D. Thakurta, S. Shankar, Intel Corp.
9:40am MS-MoM5
Thermal Characterization of Stacked 3D System-in-Package
J. Valtanen, J. Miettinen, E.O. Ristolainen, Tampere University of Technology, Finland
10:00am MS-MoM6
Advanced Clean Process by Supercritical Carbon Dioxide
H.-J. Tu, P. Chuang, C.-Y. Wang, Y.-L. Lin, H. Lo, M.-S. Zhou, M.-S. Liang, Taiwan Semiconductor Manufacturing Company, Ltd., Taiwan, R.O.C.
10:20am MS-MoM7
Two-Gas Reactive Sputtering
W.D. Sproul, D.J. Christie, D.C. Carter, Advanced Energy Industries, Inc.
10:40am MS-MoM8
Hydrogen Pressure Dependence of Trench Corner Rounding during Hydrogen Annealing
H. Kuribayashi, R. Shimizu, Fuji Electric Corporate Research and Development, Ltd., Japan, K. Sudoh, H. Iwasaki, Osaka University, Japan
11:00am MS-MoM9
Development of a Continuous Generation/Supply System of Highly-concentrated Ozone Gas for Low-temperature Oxidation Process
S. Ichimura, H. Nonaka, National Institute of Advanced Industrial Science and Technology (AIST), Japan, Y. Morikawa, T. Noyori, T. Nishiguchi, M. Kekura, Meidensha Corporation, Japan
11:20am MS-MoM10
Profile Control for Deep Silicon Etch by Sidewall Passivation in High Density Plasma
M. Khbeis, G. Metze, Laboratory for Physical Sciences, K. Powell, D. Thomas, A. Pentland, J. Hutchings, Trikon Technologies, Ltd.
11:40am MS-MoM11
The Study on Deformation of ArF Photo Resist in Dry Etching
C.-H. Shin, G.J. Min, C.J. Kang, J.T. Moon, Samsung Electronics Co., Ltd., Korea