| IUVSTA 15th International Vacuum Congress (IVC-15), AVS 48th International Symposium (AVS-48), 11th International Conference on Solid Surfaces (ICSS-11) | |
| Plasma Science | Monday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| PS-MoP1 Molecular Structure of Fluorocarbon Deposits Analyzed by EIMS and CIMS Combined with Thermal Desorption Technique N. Takada, K. Sasaki, K. Shibagaki, K. Kadota, Nagoya University, Japan |
| PS-MoP2 Real Time Analysis of the Remote Oxygen and Hydrogen Plasma Cleaning using Mass Spectroscopy H. Soh, H. Seo, Y. Kim, H. Jeon, Y.C. Kim, Hanyang University, Korea |
| PS-MoP3 Investigation and Modeling of Plasma-Wall Interactions in Inductively Coupled Fluorocarbon Plasmas and the Effects of Chamber Dimension E.A. Joseph, S.P. Sant, L.J. Overzet, M. Goeckner, University of Texas, Dallas, M.J. Kushner, University of Illinois, Urbana Champaign |
| PS-MoP4 Controllable Ion Source for Process Enhancement in a Downstream Plasma Ash Chamber A.K. Srivastava, P. Sakthivel, I. Berry, Axcelis Technologies, Inc., H.H. Sawin, Massachusetts Institute of Technology |
| PS-MoP5 A Multi-Technique Investigation of the Pulsed Plasma and Plasma Polymers of Acrylic Acid, Propanoic Acid and Hexamethylenedisiloxane S. Fraser, D. Barton, University of Sheffield, England, A.J. Roberts, Kratos Analytical, England, R.D. Short, University of Sheffield, England |
| PS-MoP6 Synthesis and Characterization of New Material (BON) for Semiconductor Applications G.C. Chen, S.-B. Lee, J.-H. Boo, Sungkyunkwan University, Korea |
| PS-MoP7 The Effect of Controlling the Ion Energies of a Plasma Polymerised Deposition Surface Upon the Film Structure D. Barton, R.D. Short, University of Sheffield, UK, J.W. Bradley, UMIST, UK |
| PS-MoP9 Uniformity Control of Electron Temperature and Density within a Commercial-scale Helicon Plasma Processing Reactor M.J. Neumann, J.E. Norman, D.N. Ruzic, University of Illinois at Urbana |
| PS-MoP10 Atomic-Order Plasma Nitridation of Ultrathin Silicon Dioxide Films T. Seino, T. Matsuura, J. Murota, Tohoku University, Japan |
| PS-MoP11 Plasma Processing Tests from a Large Area High Density Plasma Source Based on Electron Beam Ionization D. Leonhardt, Naval Research Laboratory, S.G. Walton, D.D. Blackwell, National Research Council, D.P. Murphy, R.F. Fernsler, R.A. Meger, Naval Research Laboratory |
| PS-MoP12 Energy Distributions of Ions and Neutrals from a Sputter Source G.J. Peter, N. Mueller, H. Zogg, Inficon Limited, Principality of Liechtenstein |
| PS-MoP13 Species Characterization in Inductively Driven Fluorocarbon Etch Plasmas G.A. Hebner, I.C. Abraham, Sandia National Laboratories |
| PS-MoP14 Investigation on the Plasma Uniformity in Reactive Gas ECR Plasmas M. Shindo, Y. Kawai, Kyushu University, Japan |
| PS-MoP16 A Novel Approach to Time Resolved Langmuir Probe Measurements A.K. Jindal, S.K. Kanakasabapathy, M. Goeckner, L.J. Overzet, University of Texas at Dallas |
| PS-MoP17 Evaluation of Langmuir Probe Theories via Comparison with Microwave Interferometry and Plasma Oscillation Probe Methods in ICPs J.D. Evans, F.F. Chen, University of California, Los Angeles, W. Zawalski, Hiden Analytical, Ltd., England |
| PS-MoP18 Electron Energy Control in an Inductively Coupled Plasma by Means of Induction Field Reversal H. Shindo, Tokai University, Japan, T. Urayama, ADTEC Plasma Technology CO., LTD, Japan, Y. Horiike, The University of Tokyo, Japan, S. Fujii, ADTEC Plasma Technology CO., LTD, Japan |
| PS-MoP21 Novel In Situ Diagnostics for Plasma Processing of Advanced Materials E.A. Evans, G. Zhang, University of Akron, A. Salifu, Cree Research |
| PS-MoP22 Analysis of Chlorine-Containing Plasmas G.F. Franz, Infineon Corp., Germany |
| PS-MoP23 Fluorocarbon Decomposition Products and Effluent Analysis from Atmospheric Pressure Dielectric Barrier Discharges S.F. Miralai, S. Mukhopadhyay, Wright State University, V. Shanov, University of Cincinnati, S. Datta, Procter & Gamble |
| PS-MoP24 Endpoint Detector for Controlling Clean and Passivation in HDP-CVD Processes R. Rulkens, Novellus Systems, Inc. |