IUVSTA 15th International Vacuum Congress (IVC-15), AVS 48th International Symposium (AVS-48), 11th International Conference on Solid Surfaces (ICSS-11)
    Plasma Science Monday Sessions
       Session PS-MoP

Paper PS-MoP2
Real Time Analysis of the Remote Oxygen and Hydrogen Plasma Cleaning using Mass Spectroscopy

Monday, October 29, 2001, 5:30 pm, Room 134/135

Session: Plasma Diagnostics and Plasma-Surface Interactions Poster Session
Presenter: H. Soh, Hanyang University, Korea
Authors: H. Soh, Hanyang University, Korea
H. Seo, Hanyang University, Korea
Y. Kim, Hanyang University, Korea
H. Jeon, Hanyang University, Korea
Y.C. Kim, Hanyang University, Korea
Correspondent: Click to Email
The plasma cleaning technologies have been attracting a great attention due to the demands of the compatible process with the most cluster tool and of the environmentally safe process. The photo resist (PR) ashing and PR strip processes are generally followed the silicon etching process to remove the PR and polymerized residues, respectively, during integrated circuit fabrication. However, the PR strip is the wet chemical process and causes environmental problems. Especially, the polymerized residues formed at the contact and via holes during the photo resist (PR) ashing and PR strip processes must be removed prior to the metal contact. In this study, we continuously monitored and systematically analyzed the volatile gases from the oxidized PR molecules during the low temperature remote plasma cleaning process. Mass spectroscopy (QMS200) was used for the real time monitoring of the volatile gases containing carbon and fluorine. In-situ Auger electron microscopy, X-ray photoelectron spectroscopy, atomic force microscope analysis systems were used to evaluate the cleaning effects and to avoid recontamination such as carbon absorption in the air. The surface morphologies of the samples before and after plasma cleaning were also observed using scanning electron microscope. This paper will present the oxygen and hydrogen remote plasma cleaning efficiency and its chemical reaction mechanisms. @FootnoteText@ @footnote 1@K.Sakuma, K.Machida, K.Kanoshida, Y.Sto, K.Imai and E.Arai, J.Vac.Sci. Technol.B 13(3), May/June (1995)