| AVS 65th International Symposium & Exhibition | |
| Plasma Science and Technology Division | Wednesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 2:20pm | PS+EM-WeA1 Etch Strategies for Reducing Defects and Pattern Roughness in BEOL EUV Patterning Jeffrey Shearer, IBM Research Division, Albany, NY, A. Raley, Q. Lou, J. Kaminsky, TEL Technology Center, America, LLC, L. Meli, IBM Research Division, Albany, NY |
| 2:40pm | PS+EM-WeA2 Influence of Topological Constraints on the Ion Damage Resistance of Low-k Dielectrics Qing Su, University of Nebraska-Lincoln, T. Wang, J. Gigax, L. Shao, Texas A&M University, W. Lanford, University at Albany, M. Nastasi, University of Nebraska-Lincoln, L. Li, Intel Corporation, G. Bhattarai, M.M. Paquette, University of Missouri-Kansas City, S.W. King, Intel Corporation |
| 3:00pm | PS+EM-WeA3 Invited Paper BEOL Patterning Challenges for 14nm and Beyond High Volume Manufacturing Xiang Hu, GLOBALFOUNDRIES, Y. Ren, GLOBALFOUDRIES, D. Medeiros, P. Lee, GLOBALFOUNDRIES |
| 4:20pm | PS+EM-WeA7 Invited Paper Innovative Approaches for Future Challenges in MOL/BEOL Etch Ryukichi Shimizu, Tokyo Electron Miyagi Limited, Japan |
| 5:00pm | PS+EM-WeA9 Gas-phase Pore Stuffing for Low-damage Patterning of Organo-silicate Glass Dielectric Materials Jean-Francois de Marneffe, IMEC, Belgium, M. Fujikama, T. Yamaguchi, S. Nozawa, R. Niino, N. Sato, Tokyo Electron Technology Solutions Limited, R. Chanson, K. Babaei Gavan, IMEC, Belgium, A. Rezvanov, IMEC, Belgium/Moscow Institute of Physics and Technology, F. Lazzarino, Z. Tokei, IMEC, Belgium |
| 5:20pm | PS+EM-WeA10 ALD-Sequential Etch to Address Advanced BEOL Etch/Integration Challenges Xinghua Sun, Y.-T. Lu, K. Lutker-Lee, A. Raley, TEL Technology Center, America, LLC, D. O’Meara, Tokyo Electctron, America, Inc., T. Yamamura, Tokyo Electron Miyagi Limited, Y. Kikuchi, TEL Technology Center, America, LLC |
| 5:40pm | PS+EM-WeA11 The Underlying Role of Mechanical Rigidity and Topological Constraints in Reactive Ion Etching of Amorphous Materials Gyanendra Bhattarai, S. Dhungana, B.J. Nordell, A.N. Caruso, M.M. Paquette, University of Missouri-Kansas City, W. Lanford, University at Albany, S.W. King, Intel Corporation |
| 6:00pm | PS+EM-WeA12 Plasma Processing of Phase Change Materials for PCRAM N.D. Altieri, Ernest Chen, J.P. Chang, University of California, Los Angeles, S.W. Fong, C.M. Neumann, H.-S. Wong, Stanford University, M. Shen, T.B. Lill, Lam Research Corporation |