| AVS 55th International Symposium & Exhibition | |
| Plasma Science and Technology | Friday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:20am | PS2-FrM1 Silicon Oxide Sidewall Passivation during HBr Inductively Coupled Plasma (ICP) Etching of InP and GaAs Materials for the Fabrication of Photonic Devices S. Bouchoule, S. Guilet, L. Gatilova, G. Patriarche, L. Largeau, LPN, CNRS, France, P. Chabert, LPTP, CNRS - Ecole Polytechnique, France |
| 8:40am | PS2-FrM2 Low Bias Inductively Coupled Plasma Etching of CdHgTe in CH4/H2 Based Chemistry F. Boulard, C. Cardinaud, IMN CNRS France, J. Baylet, LETI-CEA, MINATEC France |
| 9:00am | PS2-FrM3 Characterisation of InP Ridge Sidewalls Patterned in Inductively Coupled Halogen Plasmas C. Cardinaud, IMN-CNRS, France, S. Bouchoule, LPN-CNRS, France |
| 9:20am | PS2-FrM4 The Plasma Polymerization of Novel Metal Containing Monomers Via Sublimation of the Precursor Materials J.O. Enlow, UES, Inc., H. Jiang, Materials Sci. and Tech Applications, LLC, J.T. Grant, University of Dayton, K.G. Eyink, Air Force Research Laboratory, W. Su, AT&T Government Solutions, A.M. Urbas, T.J. Bunning, Air Force Research Laboratory |
| 9:40am | PS2-FrM5 Invited Paper Advancement and Characterization of 3D TSV Etch Applications C. Rusu, Lam Research |
| 10:20am | PS2-FrM7 Investigation of Bottom Profile Degradation Mechanism in Extremely High-Aspect-Ratio Feature Etching N. Negishi, M. Miyake, K. Yokogawa, Hitachi, Ltd., Japan, M. Oyama, T. Kanekiyo, Hitachi High-Technologies Corporation, Japan, M. Izawa, Hitachi, Ltd., Japan |
| 10:40am | PS2-FrM8 Very Uniform and High Rate Si Etching Process in Advanced NLD Plasma Y. Morikawa, T. Murayama, K. Suu, ULVAC, Inc., Japan |
| 11:00am | PS2-FrM9 Fabrication of Very High Aspect Ratio Vertical Through Silicon Via by a Novel Multi-step Plasma Etching Technique P. Dixit, Nanyang Technological University, Singapore, R. Chatterjee, Georgia Institute of Technology, J. Miao, Nanyang Technological University, Singapore, R. Tummala, Georgia Institute of Technology |
| 11:20am | PS2-FrM10 Through Silicon Via Etching for 3-D Interconnection using Pulse Inductively Coupled Plasma S.H. Lee, Y.D. Lim, W.J. Yoo, Sungkyunkwan University, Korea, O. Jung, S.C. Kim, H.C. Lee, Dongbuhitek, Korea |