| AVS 55th International Symposium & Exhibition | |
| Plasma Science and Technology | Friday Sessions |
| Session PS2-FrM |
| Session: | Plasma Processing for 3-D Integration, Photonics, Optoelectronics, and Memory Devices |
| Presenter: | J.O. Enlow, UES, Inc. |
| Authors: | J.O. Enlow, UES, Inc. H. Jiang, Materials Sci. and Tech Applications, LLC J.T. Grant, University of Dayton K.G. Eyink, Air Force Research Laboratory W. Su, AT&T Government Solutions A.M. Urbas, Air Force Research Laboratory T.J. Bunning, Air Force Research Laboratory |
| Correspondent: | Click to Email |
A flowing afterglow plasma reactor has been recently modified to incorporate a custom designed sublimation system for the fabrication of thin films from solid organic monomers. Some metal containing precursors such as ferrocene, as well as Cu, Fe, Mg, Ni, Pb and Zn phthalocyanines and porphorines have been successfully deposited. The optical properties of the films were investigated using variable angle spectroscopic ellipsometry and UV-Vis spectrometry, the chemical composition was determined using FT-IR and XPS and the morphology was examined using AFM and X-ray reflectivity. It was found that due to the incorporation of metal components, these films have relatively high indices of refraction when compared to conventional PECVD hydro-carbon films. Also, through the optimization of the deposition conditions original structural features were maintained in these highly crosslinked thin films. This study demonstrates that the use of sublimation opens up the PECVD technique to a wealth of new solid state and metal containing materials for the fabrication of novel optical and electronic thin films.