AVS 66th International Symposium & Exhibition | |
Plasma Science and Technology Division | Friday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
8:20am | PS+2D+SE+TF-FrM1 Invited Paper Plasma-based Synthesis of 2D Materials for Devices on Flexible Substrates N.R. Glavin, Air Force Research Laboratory, Christopher Muratore, Department of Chemical and Materials Engineering, University of Dayton |
9:00am | PS+2D+SE+TF-FrM3 Homogeneous Ternary Oxides of Aluminum with Silicon, Molybdenum, and Niobium by Plasma Enhanced ALD by Sequential Precursor Pulses Steven Vitale, MIT Lincoln Laboratory |
9:20am | PS+2D+SE+TF-FrM4 Piezoelectric Response of ZnO Thin Films Grown by Plasma-Enhanced Atomic Layer Deposition Julian Pilz, T. Abu Ali, Graz University of Technology, Austria, P. Schäffner, B. Stadlober, Joanneum Research Forschungsgesellschaft mbH, Austria, A.M. Coclite, Graz University of Technology, Austria |
10:00am | PS+2D+SE+TF-FrM6 Plasma-enhanced Molecular Layer Deposition of Boron Carbide from Carboranes Michelle M. Paquette, R. Thapa, L. Dorsett, R. Bale, S. Malik, D. Bailey, A.N. Caruso, University of Missouri-Kansas City, J.D. Bielefeld, S.W. King, Intel Corporation |
10:20am | PS+2D+SE+TF-FrM7 Gas Phase Kinetics Optimization Study for Scaling-up Atmospheric Pressure Plasma Enhanced Spatial ALD Yves Creyghton, Holst Centre / TNO, The Netherlands |
10:40am | PS+2D+SE+TF-FrM8 Invited Paper Taking Plasma ALD to the Next Level: From Fundamental Understanding to Selective 3D Processing T.F. Faraz, K. Arts, L. Martini, R. Engeln, H.C.M. Knoops, Erwin Kessels, Eindhoven University of Technology, The Netherlands |
11:20am | PS+2D+SE+TF-FrM10 Computational Investigation of Plasma Enhanced ALD of SiO2 C. Qu, University of Michigan, P. Agarwal, Y. Sakiyama, A. LaVoie, Lam Research Corporation, Mark J. Kushner, University of Michigan |
11:40am | PS+2D+SE+TF-FrM11 Analyzing Self-limiting Surface Reaction Mechanisms of Metal Alkyl Precursors and Nitrogen Plasma Species: Real-time In-situ Ellipsometric Monitoring of III-nitride Plasma-ALD Processes Ali Okyay, OkyayTech Inc., Turkey, A. Mohammad, D. Shukla, S. Ilhom, University of Connecticut, B. Johs, Film Sense LLC, B.G. Willis, N. Biyikli, University of Connecticut |
12:00pm | PS+2D+SE+TF-FrM12 Tribological Properties of Plasma Enhanced Atomic Layer Deposition TiMoN with Substrate Bias Mark Sowa, Veeco ALD, A.C. Kozen, University of Maryland, N.C. Strandwitz, T.F. Babuska, B.A. Krick, Lehigh University |