AVS 66th International Symposium & Exhibition
    Plasma Science and Technology Division Friday Sessions

Session PS+2D+SE+TF-FrM
Plasma Deposition and Plasma-Enhanced Atomic Layer Deposition

Friday, October 25, 2019, 8:20 am, Room B130
Moderators: David Boris, U.S. Naval Research Laboratory, Chenhui Qu, University of Michigan


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  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

8:20am PS+2D+SE+TF-FrM1 Invited Paper
Plasma-based Synthesis of 2D Materials for Devices on Flexible Substrates
N.R. Glavin, Air Force Research Laboratory, Christopher Muratore, Department of Chemical and Materials Engineering, University of Dayton
9:00am PS+2D+SE+TF-FrM3
Homogeneous Ternary Oxides of Aluminum with Silicon, Molybdenum, and Niobium by Plasma Enhanced ALD by Sequential Precursor Pulses
Steven Vitale, MIT Lincoln Laboratory
9:20am PS+2D+SE+TF-FrM4
Piezoelectric Response of ZnO Thin Films Grown by Plasma-Enhanced Atomic Layer Deposition
Julian Pilz, T. Abu Ali, Graz University of Technology, Austria, P. Schäffner, B. Stadlober, Joanneum Research Forschungsgesellschaft mbH, Austria, A.M. Coclite, Graz University of Technology, Austria
10:00am PS+2D+SE+TF-FrM6
Plasma-enhanced Molecular Layer Deposition of Boron Carbide from Carboranes
Michelle M. Paquette, R. Thapa, L. Dorsett, R. Bale, S. Malik, D. Bailey, A.N. Caruso, University of Missouri-Kansas City, J.D. Bielefeld, S.W. King, Intel Corporation
10:20am PS+2D+SE+TF-FrM7
Gas Phase Kinetics Optimization Study for Scaling-up Atmospheric Pressure Plasma Enhanced Spatial ALD
Yves Creyghton, Holst Centre / TNO, The Netherlands
10:40am PS+2D+SE+TF-FrM8 Invited Paper
Taking Plasma ALD to the Next Level: From Fundamental Understanding to Selective 3D Processing
T.F. Faraz, K. Arts, L. Martini, R. Engeln, H.C.M. Knoops, Erwin Kessels, Eindhoven University of Technology, The Netherlands
11:20am PS+2D+SE+TF-FrM10
Computational Investigation of Plasma Enhanced ALD of SiO2
C. Qu, University of Michigan, P. Agarwal, Y. Sakiyama, A. LaVoie, Lam Research Corporation, Mark J. Kushner, University of Michigan
11:40am PS+2D+SE+TF-FrM11
Analyzing Self-limiting Surface Reaction Mechanisms of Metal Alkyl Precursors and Nitrogen Plasma Species: Real-time In-situ Ellipsometric Monitoring of III-nitride Plasma-ALD Processes
Ali Okyay, OkyayTech Inc., Turkey, A. Mohammad, D. Shukla, S. Ilhom, University of Connecticut, B. Johs, Film Sense LLC, B.G. Willis, N. Biyikli, University of Connecticut
12:00pm PS+2D+SE+TF-FrM12
Tribological Properties of Plasma Enhanced Atomic Layer Deposition TiMoN with Substrate Bias
Mark Sowa, Veeco ALD, A.C. Kozen, University of Maryland, N.C. Strandwitz, T.F. Babuska, B.A. Krick, Lehigh University