| AVS 57th International Symposium & Exhibition | |
| Plasma Science and Technology | Tuesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:20am | PS1-TuM2 Sidewall Polymer Management of sub 20nm Shallow Isolation Trench (STI) Etch via Pulsed Plasma X. Hua, X. Ji, J. He, J.H. Choi, A. Khan, Applied Materials Inc. |
| 8:40am | PS1-TuM3 Feature Scale Model of Shallow Trench Isolation (STI) Etch in HBr Plasma and Comparison with Experiments S. Sriraman, T. Panagopoulos, A. Paterson, H. Singh, V. Vahedi, Lam Research Corporation |
| 9:00am | PS1-TuM4 Synchronous Plasma Pulsing For Etch Applications M. Haass, M. Darnon, E. Pargon, C. Petit-Etienne, L. Vallier, P. Bodart, G. Cunge, CNRS-LTM, France, S. Banna, T. Lill, Applied Materials Inc., O. Joubert, CNRS-LTM, France |
| 9:20am | PS1-TuM5 Characterization of Pulsed Plasma Etch Reactors with an Integrated Global Plasma-Feature Scale Model A. Balakrishna, A. Agarwal, P. Stout, S. Rauf, K. Collins, Applied Materials Inc. |
| 9:40am | PS1-TuM6 Atomic Layer Etching of Graphene using O2 Radical and Ar Neutral Beam W.S. Lim, Y.Y. Kim, G.Y. Yeom, Sungkyunkwan University, Republic of Korea |
| 10:40am | PS1-TuM9 Etching of Magnetic Stack for Development of Thermally-assisted Magnetic Access Random Memory J. Pereira, X. Mellhaoui, LTM - UMR 5129 CNRS, France, J. Shin, Crocus Technology, France, E. Pargon, LTM - UMR 5129 CNRS, France, J. Reid, Crocus Technology, France, O. Joubert, LTM - UMR 5129 CNRS, France |
| 11:00am | PS1-TuM10 III-V Etch Challenges for Beyond 20nm Node U. Shah, B. Turkot, M. Radosavljevic, M. Shaw, S. Clendenning, B. Chu-Kung, Intel Corp. |