AVS 46th International Symposium
    Plasma Science and Technology Division Monday Sessions

Session PS-MoM
Plasma Damage

Monday, October 25, 1999, 8:20 am, Room 609
Moderator: C.T. Gabriel, VLSI Technology


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  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

8:20am PS-MoM1
Mechanisms and Dependencies of Gate Oxide Degradation Due to Electron Shading
G.S. Hwang, K.P. Giapis, California Institute of Technology
8:40am PS-MoM2
Calculation and Measurement of Ion and Electron Shading Parameters and Comparison with Computer Simulation
S.C. Siu, R. Patrick, V. Vahedi, Lam Research Corporation
9:00am PS-MoM3
Direct Experimental Determination and Modeling of VUV induced Dielectric Conduction during Plasma Processing
M.V. Joshi, J.P. McVittie, K.C. Saraswat, Stanford University
9:20am PS-MoM4
Investigating Ion Density and Electron Temperature Effects on Plasma Damage during Pulsed and Continuous Wave Metal Etching
K.H.A. Bogart, Lucent Technologies, J.I. Colonell, Praelux, M.V. Malyshev, V.M. Donnelly, J.T.C. Lee, Lucent Technologies
9:40am PS-MoM5 Invited Paper
Sources of Plasma Induced Damage in Back-End VLSI Processing
S.W. Downey, D.W. Hwang, N. Layadi, P.W. Mason, A. Yen, V.M. Donnelly, M.V. Malyshev, Lucent Technologies, Bell Laboratories, J.I. Colonell, Praelux, Inc.
10:20am PS-MoM7
Charge Density Measurements in a Metal Etch Strip/Passivation Chamber
R.L. Jarecki, M.G. Blain, Sandia National Laboratories, J.S. Papanu, Applied Materials, Inc.
10:40am PS-MoM8
Evaluation of Tests to Examine Charging Damage in Ion Implantation and Plasma Processes
M.J. Goeckner, Varian Semiconductor Equipment Associates, J. Erhardt, AMD Inc., S.B. Felch, Varian Semiconductor Equipment Associates, K. Ahmed, AMD Inc.
11:00am PS-MoM9
Study of Synchrotron Radiation-Induced Surface-Conductivity of SiO@sub 2@ for Plasma Charging Applications
C. Cismaru, J.L. Shohet, University of Wisconsin, Madison, J.P. McVittie, Stanford University
11:20am PS-MoM10
Effect of Surface Oxide Loss on Surface Potential Measurement (SPM) Accuracy for Plasma Charging Damage Characterization
S. Ma, K. Nauka, R. Kavari, Hewlett-Packard Company