| AVS 64th International Symposium & Exhibition | |
| Plasma Science and Technology Division | Tuesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:00am | PS-TuM1 Highly Selective Silicon Dry Chemical Etch Technique for 7nm FinFET Technology and Beyond Z. Bi, Thamarai Devarajan, L. Young, B. Miao, S. Devries, N. Loubet, C. Yeung, J. Zhang, A. Greene, H. Zhou, M. Wang, J. Strane, IBM Semiconductor Technology Research, Y. Yao, IBM, D. Canaperi, C. Surisetty, IBM Semiconductor Technology Research |
| 8:20am | PS-TuM2 Anisotropic and Selective Isotropic Etching of Si / SiGe Multilayers in Surface Wave Plasmas Nick Joy, S.A. Voronin, P. Biolsi, TEL Technology Center, America, LLC, A. Ranjan, Tokyo Electron Miyagi Limited, Japan |
| 8:40am | PS-TuM3 Control of Anisotropic Simultaneous SiGe-Si Etching for Dual Channel Fin Applications Yohei Ishii, M. Walker, R. Scott-McCabe, A. Yu, Hitachi High Technologies America, Inc., K. Okuma, Hitachi High-Technologies Corp., Japan, K. Maeda, J. Sebastian, J. Manos, Hitachi High Technologies America, Inc. |
| 9:00am | PS-TuM4 Etch Rate and Profile Tailoring of Si and SiO2 through Laser-Stimulated Thermal Desorption Jason Peck, D.N. Ruzic, University of Illinois at Urbana-Champaign |
| 9:20am | PS-TuM5 Invited Paper Prediction and Control of Fluctuation of Etching Properties by Simulation Technology Nobuyuki Kuboi, M. Fukasawa, T. Tatsumi, Sony Semiconductor Solutions Corporation, Japan |
| 11:20am | PS-TuM11 Underlayer Impact on Line Width Roughness in Extreme Ultraviolet Lithography and Etch Indira Seshadri, A. DeSilva, Y. Mignot, W. Xu, L. Meli, J. Guo, S. Sieg, J.C. Arnold, N. Felix, IBM Research Division |
| 11:40am | PS-TuM12 Invited Paper Patterning Challenges and Perspective Solutions for 5nm and Beyond Ying Zhang, Applied Materials, Inc. |