| AVS 55th International Symposium & Exhibition | |
| Nanomanufacturing Focus Topic | Thursday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:00am | NM+EM+PS+NS+NC-ThM1 Invited Paper Techniques for Three Dimensional and Molecular Scale Nanofabrication J. Rogers, D. Shir, University of Illinois, Urbana-Champaign |
| 8:40am | NM+EM+PS+NS+NC-ThM3 Preparation of 25-nm-spaced PdAu Metal Electrodes on Silicon by Direct Nanotransfer Printing S. Strobel, S. Harrer, G. Penso-Blanco, G. Scarpa, G. Abstreiter, P. Lugli, Technische Universität München, Germany, M. Tornow, Technische Universität Braunschweig, Germany |
| 9:00am | NM+EM+PS+NS+NC-ThM4 Adhesion Enhancement using Plasma Processing in the Printing of Carbon-based and Organic Flexible Electronics D.R. Hines, University of Maryland, V.W. Ballarotto, C. Hull, Laboratory for Physical Sciences, G.S. Oehrlein, D.Y. Lee, University of Maryland, C.M. Stafford, C.L. Soles, E.K. Lin, J. Liu, J.-Y. Chung, National Institute of Standards and Technology, S.G. Walton, E.H. Lock, US Naval Research Laboratory |
| 9:20am | NM+EM+PS+NS+NC-ThM5 Fabrication of Microarrays with Nanoscale Chemical Contrast by Nanoimprint-Assisted Lift-Off A. Ruiz, JRC, European Commission, C.A. Mills, Inst. for Bioeng. of Catalonia, Barcelona Sci. Park, A. Valsesia, JRC, European Commission, E. Martinez, Inst. for Bioeng. of Catalonia, Barcelona Sci. Park, P. Colpo, JRC, European Commission, J. Samitier, Inst. for Bioeng. of Catalonia, Barcelona Sci. Park, F. Rossi, JRC, European Commission |
| 9:40am | NM+EM+PS+NS+NC-ThM6 Inkless Deposition of Microparticles by Electrostatic Acceleration for Materials Processing I. Eu, L. Musinski, T. Liu, University of Michigan, D. Morris, ElectroDynamic Applications, Inc., J.M. Millunchick, B. Gilchrist, A.D. Gallimore, University of Michigan |
| 10:40am | NM+EM+PS+NS+NC-ThM9 Invited Paper Plasma-Lithography Interactions for Advanced CMOS Manufacturing (45nm and Beyond) K. Kumar, International Business Machines |
| 11:20am | NM+EM+PS+NS+NC-ThM11 Etching Development and Characterization for a Novel Nano-Imprint Lithography Technology J. Chiaroni, Y. Le Cunff, C. Charpin, Minatec/Cea-Leti, France, M.P. Clement, St Microelect., France, H. Denis, Minatec/Cea-Leti, France, G. Medico, M.L. Villani, St Microelect., France, N. Rochat, A. Fanton, L. Lachal, P. Brianceau, S. Barnola, F. Perrin, E. Vermande, P. Lavios, Minatec/Cea-Leti, France, N. Khusnatdinov, D. Labrake, Molecular Imprint Inc., J.P. Gouy, Minatec/Cea-Leti, France, P. Gubbini, Molecular Imprint Inc. |
| 11:40am | NM+EM+PS+NS+NC-ThM12 Influence of Polymer Structure on Dry Etch Behavior of Resists in Soft Lithography R.L. Bruce, F. Weilnboeck, S. Engelmann, T.C. Lin, R. Phaneuf, G.S. Oehrlein, University of Maryland, College Park, B. Long, G. Willson, University of Texas, Austin, D.G. Nest, J.J. Vegh, D.B. Graves, University of California, Berkeley, A. Alizadeh, GE Global Research Center |