| AVS 55th International Symposium & Exhibition | |
| Nanomanufacturing Focus Topic | Thursday Sessions |
| Session NM+EM+PS+NS+NC-ThM |
| Session: | Printable Lithography and Processing |
| Presenter: | R.L. Bruce, University of Maryland, College Park |
| Authors: | R.L. Bruce, University of Maryland, College Park F. Weilnboeck, University of Maryland, College Park S. Engelmann, University of Maryland, College Park T.C. Lin, University of Maryland, College Park R. Phaneuf, University of Maryland, College Park G.S. Oehrlein, University of Maryland, College Park B. Long, University of Texas, Austin G. Willson, University of Texas, Austin D.G. Nest, University of California, Berkeley J.J. Vegh, University of California, Berkeley D.B. Graves, University of California, Berkeley A. Alizadeh, GE Global Research Center |
| Correspondent: | Click to Email |
For the realization of sub-10 nm resolution, soft lithography alternatives to conventional photolithography are being considered. In soft lithography, the imprint material is used for pattern definition and also as a mask for pattern transfer into underlying layers. For successful nanoscale pattern transfer, a rational design of polymer resists and an atomistic understanding of plasma-polymer interactions are required. In this study, the effect of different species of the plasma (ions, UV, neutrals) on model polymers with distinct chemical structure (styrene-, acrylate-, methacrylate-, and vinylpyridine-based) was investigated. Model polymers were exposed to Ar and C4F8/Ar plasmas. Modification of the polymer surface was characterized using in situ ellipsometry, X-ray photoelectron spectroscopy, and atomic force microscopy (AFM). The effect of crosslinking and chain scission reactions, as well as oxygen containing functional groups, is considered. Mechanisms of plasma-polymer interactions for the different polymer structures are proposed. Finally, select polymers (poly(styrene), poly(α-methylstyrene), and poly(4-vinylpyridine)) were used as imprint materials, patterned, and plasma processed. The top and sidewall profiles and morphologies were examined by AFM and secondary electron microscopy before and after exposure. The importance of polymer structure and plasma species on pattern transfer in soft lithography is discussed.