| AVS 54th International Symposium | |
| Plasma Science and Technology | Tuesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:00am | PS1+TF-TuM1 Invited Paper Characteristics for HfO2 Gate Dielectrics Deposited by Remote Plasma ALD Method S. Kim, H. Jeon, Hanyang University, South Korea |
| 8:40am | PS1+TF-TuM3 Pulsed Plasma-Enhanced Pulsed CVD of Y2O3 in MIM Capacitors C, Vallee, M. Kahn, E. Gourvest, M. Bonvalot, O. Joubert, CNRS, France |
| 9:00am | PS1+TF-TuM4 Engineering Plasma-Enhanced Chemical Vapor Deposition to Deliver Self-Limiting Deposition of Metal Oxide Thin Films M.T. Seman, S. Agarwal, Colorado School of Mines, J.J. Robbins, CMD Research, LLC, C.A. Wolden, Colorado School of Mines |
| 9:20am | PS1+TF-TuM5 Invited Paper Peter Mark Memorial Award Lecture - Plasma-assisted Atomic Layer Deposition: Applications, Opportunities, and Mechanisms W.M.M. Kessels, Eindhoven University of Technology, The Netherlands |
| 10:40am | PS1+TF-TuM9 Invited Paper Silicon Based Coatings by Means of Glow and Townsend Dielectric Barrier Discharges F. Massines, CNRS PROMES, France, N. Gherardi, LAPLACE CNRS-UPS-INP, France |
| 11:20am | PS1+TF-TuM11 Film Microstructure Control and Characterization of Ion Bombardment- Aided Remote Plasma Deposition of Silicon Dioxide Films M.A. Creatore, N.M. Terlinden, M.C.M. van de Sanden, Eindhoven University of Technology, the Netherlands |
| 11:40am | PS1+TF-TuM12 Self-Limiting Growth of Aluminum Oxide by Pulsed Plasma-Enhanced Chemical Vapor Deposition S.F. Szymanski, M.T. Seman, D. Richards, C.A. Wolden, Colorado School of Mines |
| 12:00pm | PS1+TF-TuM13 Correlation of Surface Reactivity and Gas Phase Properties of CN Active Species in the Plasma Deposition of Carbon Nitride J. Stillahn, Colorado State University, D. Liu, Dalian Nationalities University, China, E.R. Fisher, Colorado State University |