| AVS 66th International Symposium & Exhibition | |
| Plasma Science and Technology Division | Tuesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| PS-TuP2 Low-temperature Atmospheric Plasma Deposition of Photocatalytic Doped Anatase TiO2 Coatings on Polymer Substrates K. Baba, M. Quesada-Gonzalez, S. Bulou, P. Choquet, Nicolas Boscher, Luxembourg Institute of Science and Technology, Luxembourg |
| PS-TuP3 Radical Nitriding of Silicon Surface Promoted by Surface Plasmon Resonance of Gold Nanoparticle Catalyst Machiko Miyake, T. Kitajima, T. Nakano, National Defense Academy, Japan |
| PS-TuP4 Development and Characterization of a Small-Scale Helical Dielectric Barrier Discharge for Studying Plasma-Surface Interactions Nazli Turan, P.M. Barboun, W.F. Schneider, J.C. Hicks, D.B. Go, University of Notre Dame |
| PS-TuP5 Characteristics of Magnetized High Density Plasma and its Applications Jung-Hyung Kim, H.C. Lee, D.J. Seong, Korea Research Institute of Standards and Science, Republic of Korea |
| PS-TuP6 The Effect of Ionic Strength on the Absorption Spectrum of Plasma-Injected Solvated Electrons Daniel Martin, H.E. Delgado, D.M. Bartels, P. Rumbach, D.B. Go, University of Notre Dame |
| PS-TuP7 Inductively Coupled Plasma Reactive Ion Etching of Copper Thin Film using Organic Chemicals and Alcohols Moon Hwan Cha, E.T. Lim, J.S. Ryu, C.W. Chung, Inha University, Republic of Korea |
| PS-TuP8 High Resolution Quadrupole Mass Spectrometry Analysis for Fusion Reactor and Plasma Facing Materials G. Thier, Brian Regel, L. Kephart, Extrel CMS |
| PS-TuP9 Controlled Layer-by-Layer Etching of Copper Thin Films Eun Taek Lim, J.S. Ryu, M.H. Cha, C.W. Chung, Inha University, Republic of Korea |
| PS-TuP10 Effects of Bias on Quasi-Atomic Layer Etching of Silicon Dioxide by Cyclic Ar/C4F8/O2 and Ar Plasmas Xifeng Wang, University of Michigan, M. Wang, A. Mosden, P.E. Biolsi, TEL Technology Center, America, LLC, M.J. Kushner, University of Michigan |
| PS-TuP11 Electron Beam Generated Produced Plasmas Produced in Oxygen: Measurements and Simulations Scott Walton, D.R. Boris, U.S. Naval Research Laboratory, S. Rauf, Applied Materials, Inc. |
| PS-TuP12 Silicon Micro-Channel Definition Via ICP Plasma Etching Process Using Different Hard Masks H.S. Alvarez, J.A. Diniz, C.S. Ruiz, A.R. Silva, F.H. Cioldin, UNICAMP, Brazil, Valter S.N. Junior, USP - EESC, Brazil |
| PS-TuP13 Corrosion Barrier Coatings for Aerospace Materials Deposited by Atmospheric Pressure CVD Dhruval Patel, Z. Jeckell, T. Choi, D.E. Barlaz, L. Bonova, D.V. Krogstad, D.N. Ruzic, University of Illinois at Urbana-Champaign, S. Chaudhuri, University of Illinois at Chicago |
| PS-TuP14 Atmospheric Pressure Plasma: An Alternative Tool for the Synthesis of Efficient Photocatalytic Materials S. Ptasinska, Amal Sebastian, University of Notre Dame |
| PS-TuP15 Synthesis of Functional Polydopamine using Atmospheric Pressure Plasmas Yun Jong Jang, M.K. Mun, J.E. Kim, D.W. Kim, G.Y. Yeom, Sungkyunkwan University, Republic of Korea |
| PS-TuP16 Effect of Cx(x=4~7)F8 on the Etch Properties in Inductively Coupled Plasmas Hyun Woo Tak, D.I. Sung, Y.J. Shin, D.W. Kim, G.Y. Yeom, Sungkyunkwan University, Republic of Korea |
| PS-TuP19 Plasma Etching High Aspect Ratio Carbon Nanotube Structures for a Neural Probe Spencer Roberts, G. Chen, Brigham Young University |
| PS-TuP20 NOx Fixation by Atmospheric Pressure N2/O2 Filamentary DBD Plasma over Water: Physicochemical Mechanisms of Plasma-Liquid interactions Nepal Roy, C. Pattyn, A. Remy, N. Maira, F. Reniers, Université libre de Bruxelles, Belgium |
| PS-TuP21 Simulation Study of Capacitively Coupled Radio Frequency Silane/Hydrogen Plasma Discharges - Effect of Tailored Voltage Waveforms S.W. Huang, Keh-Chyang Leou, National Tsing Hua University, Taiwan, Republic of China |