| AVS 63rd International Symposium & Exhibition | |
| Plasma Science and Technology | Wednesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 2:20pm | PS+TF-WeA1 Invited Paper High Quality Film and Interface Formation using Appropriate Reaction Species Akinobu Teramoto, Tohoku University, Japan |
| 3:00pm | PS+TF-WeA3 The Synergy of Diamond-like Carbon Film PECVD Systems: Plasma Diagnostics and Film Properties Tara Van Surksum, E.R. Fisher, Colorado State University |
| 3:20pm | PS+TF-WeA4 ULK Film Dielectric Constant Restoration through Enhanced Organic Plasma Treatment Zhiguo Sun, J. Shu, P. Mennell, Q. Yuan, A. Madan, S. Molis, J. Mody, Y. Zhang, J. Shepard Jr, GLOBALFOUNDRIES |
| 4:20pm | PS+TF-WeA7 Understanding of Low Temperature ALD of Silicon Nitride H.C.M. Knoops, Oxford Instruments Plasma Technology, UK, R.H.E.C. Bosch, T. Faraz, M. van Drunen, L.E. Cornelissen, M. Creatore, Erwin Kessels, Eindhoven University of Technology, Netherlands |
| 4:40pm | PS+TF-WeA8 Plasma Assisted Atomic Layer Deposition of SiCxNy Films with Methylamine as the Carbon Source Rafaiel Ovanesyan, N. Leick, R.J. Gasvoda, Colorado School of Mines, K.M. Kelchner, D.M. Hausmann, Lam Research Corporation, S. Agarwal, Colorado School of Mines |
| 5:00pm | PS+TF-WeA9 Invited Paper Plasma Enhanced Atomic Layer Deposition in the Semiconductor Industry Adrien LaVoie, Lam Research Corporation |
| 5:40pm | PS+TF-WeA11 Substrate Biasing during Remote Plasma-ALD On Planar and 3D Substrates Tahsin Faraz, Eindhoven University of Technology, The Netherlands, H.C.M. Knoops, Oxford Instruments Plasma Technology, UK, D.M. Hausmann, J. Henri, Lam Research Corporation, W.M.M. Kessels, Eindhoven University of Technology, The Netherlands |
| 6:00pm | PS+TF-WeA12 A Novel ABC-type ALD Process for Cobalt using CoCp2 and N2 and H2 Plasmas Martijn Vos, N.F.W. Thissen, A.J. Mackus, W.M.M. Kessels, Eindhoven University of Technology, Netherlands |