AVS 61st International Symposium & Exhibition
    Electronic Materials and Processing Thursday Sessions

Session EM2-ThM
High-K Dielectrics for ReRAM and RAM

Thursday, November 13, 2014, 8:00 am, Room 314
Moderator: John Conley, Oregon State University


  Click here to Download program book for this session  
  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

8:00am EM2-ThM1 Invited Paper
Challenges and Materials Solutions for Memristive Devices (ReRAM)
Jianhua(Joshua) Yang, HP Labs
8:40am EM2-ThM3 Invited Paper
Physical Mechanisms and Scaling of the Resistive Memory (ReRAM)
Daniele Ielmini, S. Balatti, S. Ambrogio, Politecnico di Milano, Italy
9:20am EM2-ThM5 Invited Paper
Variability of Metal Oxide Based RRAM: Challenges and Opportunities
An Chen, GLOBALFOUNDRIES
11:00am EM2-ThM10 Invited Paper
High-K Development for DRAM, NAND, and ReRAM Applications
Nirmal Ramaswamy, Micron Technology
11:40am EM2-ThM12 Invited Paper
Resistive Switching Characteristics and Mechanism in Oxide Conductive-Bridge RAM
Ming Liu, Q. Liu, H.B. Lv, S.B. Long, Chinese Academy of Sciences, China