| AVS 52nd International Symposium | |
| Plasma Science and Technology | Wednesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:20am | PS+TF-WeM1 Invited Paper Developments of Plasma Copolymerization Technique for Deposition of low-k Films K. Kinoshita, A. Nakano, N. Kunimi, M. Shimoyama, J. Kawahara, Mirai-Aset, Japan, O. Kiso, Y. Seino, Y. Takasu, Mirai-Asrc, Aist, Japan, M. Komatsu, Sumitomo Chem., Japan, K. Nakamura, Chubu University, Japan, T. Kikkawa, Hiroshima Univ., Japan |
| 9:00am | PS+TF-WeM3 Amorphous Carbon Thin Films Deposition by Pulsed Substrate Biased PECVD using a CH@sub 4@-CO@sub 2@ Gas Mixture G. Gottardi, N. Laidani, L. Calliari, M. Filippi, ITC-Irst (Centro per la Ricerca Scientifica e Tecnologica), Italy, R.S. Brusa, C. Macchi, S. Mariazzi, Università di Trento, Italy, M. Anderle, ITC-Irst (Centro per la Ricerca Scientifica e Tecnologica), Italy |
| 9:20am | PS+TF-WeM4 Multi-hollow Plasma CVD Method for Depositing Cluster-free a-Si:H Films K. Koga, K. Bando, M. Shiratani, Y. Watanabe, Kyushu University, Japan |
| 9:40am | PS+TF-WeM5 Proton/Deuteron Exchange in Functional Plasma Polymer Films (A Neutron and X-ray Reflectometry Study) B.W. Muir, C. Fong, J. Oldham, P.G. Hartley, K. Mc Lean, CSIRO, Australia, A. Nelson, M. James, Australian Nuclear Science and Technology Organisation |
| 10:00am | PS+TF-WeM6 Anisotropic Deposition of Cu and Ru in Trenches by H-assisted Plasma CVD M. Shiratani, T. Kaji, K. Koga, Kyushu University, Japan |
| 10:20am | PS+TF-WeM7 Invited Paper Metal ALD Challenges in Microelectronics Fabrication K. Leeser, Novellus Systems Inc. |
| 11:00am | PS+TF-WeM9 Plasma-assisted Atomic Layer Deposition of TiN Films at Low Substrate Temperatures W.M.M. Kessels, S.B.S. Heil, E. Langereis, Eindhoven University of Technology, The Netherlands, F. Roozeboom, Philips Research Laboratories, The Netherlands, M.C.M. Van De Sanden, Eindhoven University of Technology, The Netherlands |
| 11:20am | PS+TF-WeM10 Characteristics of HfN deposited by using Remote Plasma Enhanced Atomic Layer Deposition Method K.W. Lee, S.J. Han, G.J. Kim, W.H. Jeong, H.T. Jeon, Hanyang University, Korea |
| 11:40am | PS+TF-WeM11 Plasma-Enhanced Atomic Layer Deposition for Compositionally Controlled Metal Oxide Thin Films R.M. Martin, K.M. Cross, J.P. Chang, University of California, Los Angeles |