| AVS 52nd International Symposium | |
| Plasma Science and Technology | Thursday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:20am | PS+MS-ThM1 Invited Paper Particle Modeling of Plasmas and Gases in Materials Processing K. Nanbu, T. Furubayashi, Tohoku University, Japan |
| 9:00am | PS+MS-ThM3 Coupled Analysis of Inductively-coupled CF@sub 4@ Plasmas and Radicals Flow H. Takekida, K. Nanbu, Tohoku University, Japan |
| 9:20am | PS+MS-ThM4 Effects of an Insulating Focus Ring on a Uniformity of Radical/Ion Distributions in a Wafer Interface in a 2f-CCP Etcher T. Yagisawa, T. Makabe, Keio University, Japan |
| 9:40am | PS+MS-ThM5 Simulation in Advanced Dielectric Etch Equipment Design and Process Tuning K. Bera, D. Hoffman, G.A. Delgadino, J. Carducci, Y. Ye, S. Ma, Applied Materials, Inc. |
| 10:00am | PS+MS-ThM6 Effect of Reactor Geometry on Ion Energy Distributions for Pulsed Plasma Doping (P@super 2@LAD)@footnote 1@ A. Agarwal, University of Illinois at Urbana-Champaign, M.J. Kushner, Iowa State University |
| 10:20am | PS+MS-ThM7 Computational Modeling of Process Induced Damage During Back End of Line Wafer Processing S. Rauf, M. Rasco, A. Haggag, R. Chatterjee, M. Moosa, K. Junker, P. Ventzek, Freescale Semiconductor, Inc. |
| 10:40am | PS+MS-ThM8 Computational Model for Ion Beam Extraction from a Pulsed Plasma Through a Grid S.-K. Nam, V.M. Donnelly, D.J. Economou, University of Houston |
| 11:00am | PS+MS-ThM9 CKnudsen - a Chemkin-based Collisionless Transport and Surface Reaction Simulator A.H. Labun, University of British Columbia - Okanagan, Canada |
| 11:20am | PS+MS-ThM10 Simplified Model for the DC Planar Magnetron Discharge G. Buyle, D. Depla, R. De Gryse, Ghent University, Belgium |