AVS 51st International Symposium
    Manufacturing Science and Technology Wednesday Sessions

Session MS+AS-WeA
Non-Destructive Analysis and Metrology for Advanced Manufacturing

Wednesday, November 17, 2004, 2:00 pm, Room 303B
Moderator: A. Testoni, Varian Semiconductor Equipment


  Click here to Download program book for this session  
  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

2:00pm MS+AS-WeA1
Advances in X-ray Reflectivity (XRR) and X-ray Fluorescence (XRF) Measurements Provide Unique Advantages for Barrier and Metal Layer Measurements of 65 nm Node Devices
J.S. Spear, Technos International, H. Murakami, S. Terada, Technos Company Limited, Japan
2:20pm MS+AS-WeA2 Invited Paper
Non-Destructive Ultra-Thin Film (0-100A) Analysis in the Lab and the Fab.
C.R. Brundle, C. R. Brundle and Associates
3:00pm MS+AS-WeA4
Crystalline Structure and Stress Characterization in Thin Films by Means of Optical Spectroscopy
G. Conti, Y. Uritsky, Applied Materials, Inc.
3:20pm MS+AS-WeA5
Optical Properties (IR to VUV) and Birefringence of Graphite-like Amorphous Carbon
S. Zollner, R. Liu, R.B. Gregory, W. Qin, J. Kulik, N.V. Edwards, K. Junker, Motorola, T.E. Tiwald, J.A. Woollam Co.
3:40pm MS+AS-WeA6 Invited Paper
Metrology for Advanced Manufacturing
M.I. Current, Frontier Semiconductor
4:20pm MS+AS-WeA8
Total Analysis of the Gases in Semiconductor Manufacturing Process: Use of Ion Attachment Mass Spectrometry
M. Nakamura, Y. Taneda, Y. Hirano, Y. Shiokawa, ANELVA Technix Corporation, Japan, M. Takayanagi, M. Nakata, Tokyo University of Agriculture and Technology, Japan
4:40pm MS+AS-WeA9
Optimizing and Managing Calibration Gas Inventories to Address Accuracy, Analysis Shelf Life and the Cost of Ownership
P. Somssich, Osram Sylvania, Inc.