| AVS 50th International Symposium | |
| Manufacturing Science and Technology | Tuesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:20am | MS-TuM1 Invited Paper Challenges and Advances in Packaging Technology Development for IC Processing H. Hosack, Semiconductor Research Corporation |
| 9:00am | MS-TuM3 Invited Paper Interfacial Engineering for Reliability Improvement of Cu/Low k Interconnects P.S. Ho, University of Texas |
| 9:40am | MS-TuM5 Invited Paper Forming Laminar Cu/Substrate Interfaces: Vacuum vs. Electrochemical Processing N.P. Magtoto, J. Liu, J. Lei, X. Zhao, J.A. Kelber, University of North Texas |
| 10:20am | MS-TuM7 Invited Paper Challenges and Advances in Thin Film Mechanics Z. Suo, Princeton University |