AVS 49th International Symposium | |
Microelectromechanical Systems (MEMS) | Wednesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
MM-WeP1 Metallization Schemes for RF MEMS Switches K. Leedy, R. Cortez, W. Cowan, J. Ebel, J. McFall, R. Strawser, A. Walker, Air Force Research Laboratory |
MM-WeP2 Inorganic Electret Using SiO@sub 2@ Thin Films Prepared by r.f. Magnetron Sputtering T. Minami, T. Yamatani, T. Utsubo, T. Miyata, Kanazawa Institute of Technology, Japan, Y. Ohbayashi, Hosiden Corporation, Japan |
MM-WeP3 MEMS Electrostatically Actuated Vertical Mirror Switch for Optical Transceiver M.W. Lee, K.C. Lee, S.B. Jo, B.H. O, S.G. Lee, S.G. Park, E.H. Lee, Inha University, Rep. of Korea, H.S. Lee, H.G. Ryu, Neoptek, Rep. of Korea |
MM-WeP4 Development of Microfluidic Devices for Gas Centrifuge Separation S. Li, R. Ghodssi, University of Maryland |
MM-WeP5 Characterization of the Residual Stress in Titanium/Platinum and Tantalum/Platinum Thin Film Electrodes used in the Processing of PZT MEMS Devices R.G. Polcawich, J.P. Clarkson, J. Pulskamp, A. Wickenden, M. Wood, K. Kirchner, M. Ervin, E. Zakar, M. Dubey, U.S. Army Research Laboratory |
MM-WeP6 Mitigation of Residual Film Stress Deformation in Multi-Layer MEMS Devices J. Pulskamp, B. Piekarski, R.G. Polcawich, A. Wickenden, M. Dubey, U.S. Army Research Laboratory |
MM-WeP7 Epitaxial Growth and Characterization of the Ferromagnetic Shape Memory Alloy Co@sub2@NiGa on (001) GaAs T.C. Shih, J.W. Dong, J.Q. Xie, X.Y. Dong, S. McKernan, R.D. James, C.J. Palmstrom, University of Minnesota |
MM-WeP8 Micromirror Coatings with Low-stress, High Reflectivity Y.N. Picard, University of Michigan--Ann Arbor, D.P. Adams, O.B. Spahn, Sandia National Laboratories, S.M. Yalisove, University of Michigan--Ann Arbor, D.J. Dagel, Sandia National Laboratories |
MM-WeP9 Deep Reactive Ion Etching of Silicon Using an Aluminum Etching Mask W. Wang, P. Reinhall, University of Washington |