AVS 49th International Symposium
    Microelectromechanical Systems (MEMS) Wednesday Sessions
       Session MM-WeP

Paper MM-WeP3
MEMS Electrostatically Actuated Vertical Mirror Switch for Optical Transceiver

Wednesday, November 6, 2002, 11:00 am, Room Exhibit Hall B2

Session: Poster Session
Presenter: M.W. Lee, Inha University, Rep. of Korea
Authors: M.W. Lee, Inha University, Rep. of Korea
K.C. Lee, Inha University, Rep. of Korea
S.B. Jo, Inha University, Rep. of Korea
B.H. O, Inha University, Rep. of Korea
S.G. Lee, Inha University, Rep. of Korea
S.G. Park, Inha University, Rep. of Korea
E.H. Lee, Inha University, Rep. of Korea
H.S. Lee, Neoptek, Rep. of Korea
H.G. Ryu, Neoptek, Rep. of Korea
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We have developed a simple structured MEMS vertical mirror switch for optical transceivers. As the optical characteristics and mechanical stability of MEMS switches is sufficient for excellent performance in communication networks, it is necessary to lower the fabrication cost by simplifying or eliminating processes of manual assembly or alignment. Here, novel structures for mirror assembly and stopper are proposed and fabricated to satisfy simplicity and accuracy of a vertically-assembled mirror, made with only three layers by deposition, polysilicon, silicon-oxide, silicon-nitride layers on a silicon substrate. Poly-silicon layer is to build a cantilever and a mirror. The silicon-oxide layer is a sacrificial layer and the silicon nitride layer is for electrical isolation. Fabrication processes of semiconductor micromachine offers accurate position due to it's nature. PR-pads are also used for the technique of photoresist(PR) applied self-assembly (the works of R.R.A. Syms@footnote 1@). The characteristics of fabricated devices will be discussed in detail. Low actuation voltage and other performances are considered to be enough for the application in optical communication systems. @FootnoteText@ @footnote 1@ Richard R.A. Syms, Surface Tension Powered Self-Assembly of 3-D Micro-Optomechanical Structures, Journal of Microelectromechanical Systems, Vol. 8, No. 4, Dec. 1999.