IUVSTA 15th International Vacuum Congress (IVC-15), AVS 48th International Symposium (AVS-48), 11th International Conference on Solid Surfaces (ICSS-11)
    Dielectrics Monday Sessions

Session DI2-MoP
Low K Dielectrics Poster Session

Monday, October 29, 2001, 5:30 pm, Room 134/135


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Click a paper to see the details. Presenters are shown in bold type.

DI2-MoP1
Deposition of Si-C-O-H Alloy Dielectric Films as a Low Dielectric Permittivity Insulators
B.K. Hwang, Dow Corning Corporation, M.J. Loboda, Wacker Siltronic Corporation, W.D. Gray, G.A. Cerny, R.F. Schneider, J.A. Seifferly, D.W. Roehl, Dow Corning Corporation
DI2-MoP2
Characterization of Plasma-CVD Grown Low-k Porous Silica Films using Positron-annihilation Lifetime Spectroscopy
T. Ohdaira, R. Suzuki, National Institute of Advanced Industrial Technology (AIST), Japan, Y. Shioya, Semiconductor Process Laboratory Co., Ltd., Japan, T. Ishimaru, Canon Sales Co. Inc., Japan
DI2-MoP3
Plasma-Reacting Behaviour of Spin-on Hybrid Organic Siloxane Polymer (HOSP) Low-Dielectric-Constant Thin Films
S.-T. Chen, G.-S. Chen, Feng Chia University, Taiwan, T.-C. Chang, National Sun Yat-Sen University, Taiwan, C.-P. Liu, National Cheng Kung University, Taiwan
DI2-MoP4
Process Characterization of Low Dielectric Constant Silicon Containing Fluorocarbon Films by Plasma Enhanced Chemical Vapor Deposition
Y.Y. Jin, Louisiana State University, H. Kim, Kyungpook National University, S. Korea, G.S. Lee, Louisiana State University
DI2-MoP5
Etching Characteristics of Polyimide Film as Interlayer Dielectric Using Inductively Coupled Plasma
P.S. Kang, C.I. Kim, Chung-Ang University, Korea, S.G. Kim, ETRI, Korea, H.S. Choi, Juseong College, Korea, C.I. Lee, Ansan College of Technology, Korea, E.G. Chang, Chung-Ang University, Korea
DI2-MoP6
An Opportunity to Study the Outgassing Behavior of a Novel Organic Low K Material
J.F. Bernard, S. Pangrle, C. Gabriel, Advanced Micro Devices
DI2-MoP8
The Effect of Hydrogen Plasma Treatment on Low-k Hybird-Organic-Siloxane-Polymer (HOSP) Against Damage During Photoresist Removal
T.C. Chang, National Sun Yat-Sen University, Taiwan, R.O.C., Y.S. Mor, National Chiao Tung University,Taiwan, R.O.C., P.T. Liu, National Nano Device Laboratory, Taiwan, R.O.C, T.M. Tsai, C.W. Chen, National Chiao Tung University, Taiwan, R.O.C., W.C. Gau, National Tsing Hua University, Taiwan, R.O.C., S.M. Sze, National Chiao Tung University, Taiwan, R.O.C.