AVS 47th International Symposium
    Manufacturing Science and Technology Wednesday Sessions

Session MS-WeA
Process Integration (Cu/Low-k/300mm)

Wednesday, October 4, 2000, 2:00 pm, Room 304
Moderator: M. Surendra, IBM T.J. Watson Research Center

  Click here to Download program book for this session  
  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

2:00pm MS-WeA1 Invited Paper
Integration Challenges for Copper Metallization with Low-k Dielectrics
B.L. Chin, Applied Materials
2:40pm MS-WeA3 Invited Paper
Adventure of the first 300mm Pilot Line
M. Peschke, Semiconductor 300 GmbH&Co.KG, Germany
3:20pm MS-WeA5
Cluster Formation on Copper Evaporated Onto Dow Cyclotene 3022
E. Sacher, D.-Q. Yang, S. Poulin, S. Rodrigues, L. Martinu, M. Meunier, Ecole Polytechnique, Canada
3:40pm MS-WeA6
FSG Film Characterization and Process Development for Copper/Damascene Technology
J.S. Martin, K.J. Taylor, J.D. Luttmer, A.R.K. Ralston, T.D. Bonifield, J.A. West, Texas Instruments, Inc., C.T. Adams, K.-H. Chew, A. Bayman, B. van Schravendijk, Novellus Systems, Inc.
4:00pm MS-WeA7 Invited Paper
300mm Manufacturing Meterology Needs
R. Goodall, Sematech