| AVS 47th International Symposium | |
| Material Characterization | Friday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:20am | MC+NS-FrM1 RBS, AFM, and AES Characterization of Pt Films Deposited by Ion Assisted CVD B. Rogers, K.A. Telari, H. Fang, L. Shen, R.A. Weller, Vanderbilt University, D. Braski, Oak Ridge National Laboratory |
| 8:40am | MC+NS-FrM2 Material and Interface Characterization of Locally Deposited Dielectrics and Metals Fabricated with a Focused Ion Beam (FIB) H.D. Wanzenboeck, H. Langfischer, E. Bertagnolli, H. Stoeri, M. Gritsch, H. Hutter, Vienna University of Technology, Austria |
| 9:00am | MC+NS-FrM3 Invited Paper Three-Dimensional Material Characterization using Focused Ion Beams (FIB) R.J. Young, FEI Company |
| 9:40am | MC+NS-FrM5 Visualizing Interfacial Structure at Non-Common-Atom Heterojunctions with Cross-Sectional Scanning Tunneling Microscopy@footnote 1@ J. Steinshnider, M. Weimer, Texas A&M University, R. Kaspi, Air Force Research Laboratory, G.W. Turner, Lincoln Laboratory, M.I.T. |
| 10:00am | MC+NS-FrM6 Atomic Resolved Spectroscopic Study of AlGaAs/GaAs/InGaAs by Cross-sectional Scanning Tunneling Microscope J. Yu, L. Liu, J. Li, J.W. Lyding, University of Illinois |
| 10:20am | MC+NS-FrM7 Scanning Spreading Resistance Microscopy of MOCVD Grown InP Structures St.J. Dixon-Warren, S. Ingrey, Nortel Networks, Canada |
| 10:40am | MC+NS-FrM8 XPS Analysis of Interfacial WO@sub x@ using Linear Least Squares and Standard Curve Fitting Routines D.K. Fillmore, Micron Technology, Inc. |
| 11:00am | MC+NS-FrM9 Investigations into the Chemical Nature of the Interfaces of Cu and Ta with SiN J.F. Bernard, E. Adem, S. Avanzino, M.-V. Ngo, Advanced Micro Devices |
| 11:20am | MC+NS-FrM10 On the Organic Content and Outgassing Behavior of Organometallic-based CVD-TiN Films J.F. Bernard, E. Adem, Advanced Micro Devices |