AVS 45th International Symposium
    Plasma Science and Technology Division Wednesday Sessions

Session PS-WeA
Plasma-Surface Interactions I

Wednesday, November 4, 1998, 2:00 pm, Room 318/319/320
Moderator: V.M. Donnelly, Bell Laboratories, Lucent Technologies


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Click a paper to see the details. Presenters are shown in bold type.

2:00pm PS-WeA1
Surface Reactions and Hydrogen Coverage on Plasma Deposited Hydrogenated Amorphous Silicon and Nanocrystalline Silicon Surfaces
D.C. Marra, S. Ramalingam, E. Edelberg, D. Maroudas, E.S. Aydil, University of California, Santa Barbara
2:20pm PS-WeA2
Gas Phase and Surface Kinetics in Plasma Enhanced Deposition of Silicon Nitride: Effect of Gas Dilution on Electron Energy Distribution, Radical Generation, and Film Composition
T.M. Klein, C.S. Yang, A.I. Chowdhury, G.N. Parsons, North Carolina State University
2:40pm PS-WeA3
Atomistic Simulation of Plasma Enhanced Chemical Vapor Deposition of Hydrogenated Amorphous Silicon Films
S. Ramalingam, D. Maroudas, E.S. Aydil, University of California, Santa Barbara
3:00pm PS-WeA4
The Ion-assisted Etching and Profile Development of Silicon in Molecular and Atomic Chlorine: Experiment, Modeling, and Simulation
J.A. Levinson, E.S.G. Shaqfeh, Stanford University, M. Balooch, A.V. Hamza, Lawrence Livermore National Laboratory
3:20pm PS-WeA5
The Role of Etching Products on the Chemical Composition and Thickness of the Chlorinated Surface Layer That Forms During Etching of Silicon in a Chlorine Plasma
K.H.A. Bogart, V.M. Donnelly, Bell Laboratories, Lucent Technologies
3:40pm PS-WeA6
Reactive Ion Etching of Si by Cl, Cl@sub 2@, and Ar Ions: Molecular Dynamics Simulations with Comparisons to Experiment
D.E. Hanson, J.D. Kress, A.F. Voter, Los Alamos National Laboratory
4:00pm PS-WeA7
Investigation of Si-poly Etch Process for 0.1 µm Gate Patterning and Beyond
L. Vallier, L. Desvoivres, M. Bonvalot, O. Joubert, France Telecom-CNET, S. Tedesco, B. Dal’Zotto, CEA-LETI, France
4:20pm PS-WeA8
Mechansims in High Aspect Ratio Oxide Feature Etching using Inductively Coupled Fluorocarbon Plasmas
M. Schaepkens, G.S. Oehrlein, State University of New York, Albany, K.G. Donohoe, Micron Technology, Inc., J.M. Cook, Lam Research Corporation
4:40pm PS-WeA9
Surface Reactivity of CF and CF@sub 2@ Radicals Measured Using Laser-Induced Fluorescence and CHF@sub 3@ Plasma Molecular Beams
N.E. Capps, N.M. Mackie, E.R. Fisher, Colorado State University
5:00pm PS-WeA10
Optical Monitoring of Surface Adlayers by Laser-induced Thermal Desorption during Plasma Etching of Si and Ge
J.Y. Choe, I.P. Herman, Columbia University, V.M. Donnelly, Bell Laboratories, Lucent Technologies