AVS 45th International Symposium
    Manufacturing Science and Technology Group Thursday Sessions

Session MS-ThP
Manufacturing Science and Technology Group Poster Session

Thursday, November 5, 1998, 5:30 pm, Room Hall A


  Click here to Download program book for this session  
  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

MS-ThP1
Dynamic Simulation Based Learning Tools for Manufacturing Education and Training
G.W. Rubloff, A.R. Rose, Y. Sankholkar, University of Maryland, D.E. Eckard, North Carolina State University
MS-ThP2
Surface Cleaning on Aluminum for UHV using Supercritical Fluid CO@sub 2@ including NaCl and H@sub 2@O as Impurities
T. Momose, H. Yoshida, Miyagi National College of Technology, Japan, Z. Sherverni, T. Ebina, Y. Ikushima, National Industrial Research Institute of Tohoku, Japan
MS-ThP3
Design of Dynamic Simulation Experiments for Assessing Manufacturing Metrics
R.Z. Shi, Z. Han, K. Moores, E. Li, Z. Chen, G.W. Rubloff, University of Maryland
MS-ThP4
Fluid Simulation of Distributed Gas Injection for Aluminum and Photoresist Etch
D.F. Beale, N. Williams, Lam Research Corporation
MS-ThP6
Reaction Products in a-C:H Film Growth by DC Glow Discharges in the Novillo Tokamak
R. Valencia, Instituto Nacional de Investigaciones Nucleares (ININ), México, J. de la Rosa, Instituto Politécnico Nacional, México, E. Camps, R. López, ININ, México
MS-ThP7
Physically-based Dynamic Simulation of a Tungsten CVD Cluster Tool
J.N. Kidder, Jr., N. Gupta, G.W. Rubloff, University of Maryland
MS-ThP8
Computer Simulation of Three-Dimensional Asymmetries in Inductively Coupled Plasma Reactors
T. Panagopoulos, V. Midha, D.J. Economou, University of Houston
MS-ThP9
Ion Beam Deposition Systems for Highly Uniform Defect-free Coatings for Electronic Manufacturing Applications
A.V. Hayes, H. Hegde, V. Kanarov, C.C. Fang, J. Wang, D. Kania, Veeco Instruments, Inc.
MS-ThP10
Estimation of the Ion Energy Distribution Function at Sputter Coils in PVD-IMP Systems
R. Veerasingam, P. Gopalraja, E Kim, J.C. Forster, Applied Materials, Inc.