AVS 64th International Symposium & Exhibition
    Plasma Science and Technology Division Wednesday Sessions

Session PS-WeM
Advanced BEOL/Interconnect Etching

Wednesday, November 1, 2017, 8:00 am, Room 23
Moderators: Fred Roozeboom, TNO-Holst Centre & Eindhoven University of Technology, The Netherlands, GeunYoung Yeom, Sungkyunkwan University, Republic of Korea

  Click here to Download program book for this session  
  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

8:00am PS-WeM1
Plasma Etch Considerations for EUV Quad-layer Patterning Stacks
Angélique Raley, TEL Technology Center, America, LLC, J.C. Shearer, I.P. Seshadri, A. De Silva, J.C. Arnold, N. Felix, IBM Research Division, Albany, NY, H. Cottle, A. Metz, TEL Technology Center, America, LLC
8:20am PS-WeM2
Direct Metal Etch Evaluation for Advanced Interconnect
Sara Paolillo, F. Lazzarino, N. Rassoul, D. Wan, D. Piumi, Z. Tokei, IMEC
8:40am PS-WeM3 Invited Paper
Evolution of Dielectric Etchers
Hiromasa Mochiki, Tokyo Electron Miyagi Limited, Japan
9:20am PS-WeM5
Etch Residue Formation and Growth on Patterned Porous Dielectrics: Angle-resolved XPS and Infrared Characterization
QuocToan Le, E. Kesters, F. Holsteyns, IMEC, Belgium
9:40am PS-WeM6
Etch Challenges Associated with Sub-36nm Pitch BEOL EUV Patterning
Jeffrey Shearer, IBM Research Division, A. Raley, TEL Technology Center, America, LLC, A. De Silva, L. Meli, I.P. Seshadri, R.K. Bonam, N.A. Saulnier, B. Briggs, IBM Research Division, T. Oh, Samsung Electronics Co. Ltd., A. Metz, TEL Technology Center, America, LLC, J.C. Arnold, IBM Research Division
11:00am PS-WeM10
ALD-SiO2 Chamfer-Less-Flow for Dual Damascene Integration
Xinghua Sun, T. Yamamura, A. Metz, P. Biolsi, TEL Technology Center, America, LLC, H. Nagai, R. Asako, Tokyo Electron Limited PCDC, Japan
11:20am PS-WeM11
Tone Reversal Technology Development Targeting Below 5nm Technology Node Applications
Stefan Decoster, F. Lazzarino, X. Piao, N. Rassoul, IMEC, Belgium, Y. Fourprier, TEL Technology Center, America, LLC, D. Piumi, IMEC, Belgium
11:40am PS-WeM12
Towards the Elimination of Ultra-Low k Ash Damage Using an In Situ­ Plasma Polymerized Film during Etch
Katie Lutker, TEL Technology Center, America, LLC
12:00pm PS-WeM13
Direct Metal Nanowire Patterning Using Ion Beam Etch
Shreya Kundu, IMEC, Belgium, S. Dutta, KU Leuven, IMEC, Belgium, A. Gupta, G. Jamieson, D. Piumi, J. Boemmels, C.J. Wilson, Z. Tokei, C. Adelmann, IMEC, Belgium