AVS 62nd International Symposium & Exhibition
    Plasma Science and Technology Tuesday Sessions

Session PS-TuM
Advanced BEOL/Interconnect Etching

Tuesday, October 20, 2015, 8:00 am, Room 210B
Moderator: Tetsuya Tatsumi, Sony Corporation, Japan


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  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

8:00am PS-TuM1 Invited Paper
Interconnect Patterning in the EUV Era
John Arnold, IBM Research Division, Albany, NY
8:40am PS-TuM3
Challenges for the sub-32nm Pitch Self-aligned Quadruple Patterning (SAQP) at Back End of Line (BEOL)
Nihar Mohanty, R. Farrell, A. Raley, E. Franke, J. Smith, S. Song, A. Ko, A. Ranjan, A. deVilliers, P. Biolsi, TEL Technology Center, America, LLC, W. Wang, G. Beique, C. Labelle, L. Sun, R. Kim, Globalfoundries, Ny, Usa
9:00am PS-TuM4
Novel Patterning Process for the 7xnm and Beyond
Toru Hisamatsu, Tokyo Electron Miyagi Limited, Japan, T. Oishi, S. Ogawa, Tokyo Electron Miyagi Limited, Y. Kihara, M. Honda, Tokyo Electron Miyagi Limited, Japan
9:20am PS-TuM5
Advanced Interconnect Process Techniques with EUV Photolithographic Masks and Sub-50nm Pitch Structures
Jessica Dechene, J.C. Shearer, IBM Research Division, A.P. Labonte, GLOBALFOUNDRIES, J. Lucas, H. Matsumoto, B. Messer, A. Metz, TEL Technology Center, America, LLC, C. Labelle, GLOBALFOUNDRIES, J.C. Arnold, IBM Research Division
9:40am PS-TuM6
Advanced Plasma Etch Techniques for Sub-50nm Pitch Contact & Interconnect Etches
Andre Labonte, Globalfoundries, NY, USA, R. Chao, J.M. Dechene, IBM Albany Nanotech Center, B. Nagabhirava, P. Wang, P. Friddle, Lam Research, N. Rassoul, ST Microelectronics, C. Labelle, Globalfoundries, NY, USA, J.C. Arnold, IBM Albany Nanotech Center, M. Goss, Lam Research
11:20am PS-TuM11
Characterization of Patterned Porous Low-k Dielectrics after Plasma Patterning and Subsequent Wet Processing/Cleaning
QuocToan Le, E. Kesters, S. Decoster, B.T. Chan, F. Holsteyns, IMEC, Belgium, S. De Gendt, IMEC, KU Leuven Belgium
11:40am PS-TuM12
Cryogenic Etching of Porous Organosilicate Low-k Materials: Reduction of Plasma Induced Damage
Floriane Leroy, T. Tillocher, GREMI CNRS/Université d'Orléans, France, L. Zhang, IMEC, KU Leuven, Belgium, P. Lefaucheux, GREMI CNRS/Université d'Orléans, France, K. Yatsuda, TEL, Japan, K. Maekawa, TEL Technology Center, America, LLC, J.-F. de Marneffe, M. Baklanov, IMEC, Belgium, R. Dussart, GREMI CNRS/Université d'Orléans, France
12:00pm PS-TuM13
Remote Shielded Microwave Mini Plasma Source for Sample Cleaning
Herman Bekman, R.J. Bolt, F.A. Nennie, P.M. Muilwijk, F.T. Molkenboer, N.B. Koster, O. Kievit, TNO Technical Sciences, Netherlands