| AVS 55th International Symposium & Exhibition | |
| Manufacturing Science and Technology | Monday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:20am | MS+NC-MoM1 A Metal Hardmask Approach for the Contact Patterning of a 0.186 μm2 SRAM Cell Exposed with EUV Lithography J.-F. de Marneffe, D. Goossens, A. Vandervorst, S. Demuynck, A.M. Goethals, J. Hermans, F. Van Roey, B. Baudemprez, S. Brus, C. Vrancken, IMEC, Belgium |
| 8:40am | MS+NC-MoM2 Improved Mechanistic Understanding of Millisecond Annealing Techniques for Ultrashallow Junction Formation Y.V. Kondratenko, C.T.M. Kwok, E.G. Seebauer, University of Illinois, Urbana-Champaign |
| 9:00am | MS+NC-MoM3 Invited Paper Challenges and Opportunities for 32nm Node CMOS and Beyond B. Doris, IBM Research at Albany Nanotech |
| 10:20am | MS+NC-MoM7 Multi Level “Air Gap” Integration for Advanced Technology Nodes F. Gaillard, D. Bouchu, CEA-Leti-MINATEC, France, R. Gras, STMicroelectronics, France, S. Moreau, CEA-Leti-MINATEC, France, G. Passemard, J. Torres, STMicroelectronics, France |
| 10:40am | MS+NC-MoM8 Chemical Vapor Deposition of Manganese Self-Aligned Diffusion Barriers for Copper Interconnections in Microelectronics H. Kim, Y. Au, H. Wang, H. Bhandari, Y. Liu, Harvard University, D.K. Lee, Samsung, Y. Lin, R.G. Gordon, Harvard University |
| 11:00am | MS+NC-MoM9 Invited Paper What Photoemission Can Tell Us About High-K Dielectrics R.L. Opila, G. Liu, University of Delaware |
| 11:40am | MS+NC-MoM11 Influence of Room Temperature Control System on AFM Imaging J. Fu, National Institute of Standards and Technology, W. Chu, Harbin Institute of Technology, China, T. Vorburger, National Institute of Standards and Technology |