AVS 55th International Symposium & Exhibition
    Manufacturing Science and Technology Monday Sessions

Session MS+NC-MoM
CMOS Extension and Metrology

Monday, October 20, 2008, 8:20 am, Room 311
Moderator: V. Ku, TSMC


  Click here to Download program book for this session  
  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

8:20am MS+NC-MoM1
A Metal Hardmask Approach for the Contact Patterning of a 0.186 μm2 SRAM Cell Exposed with EUV Lithography
J.-F. de Marneffe, D. Goossens, A. Vandervorst, S. Demuynck, A.M. Goethals, J. Hermans, F. Van Roey, B. Baudemprez, S. Brus, C. Vrancken, IMEC, Belgium
8:40am MS+NC-MoM2
Improved Mechanistic Understanding of Millisecond Annealing Techniques for Ultrashallow Junction Formation
Y.V. Kondratenko, C.T.M. Kwok, E.G. Seebauer, University of Illinois, Urbana-Champaign
9:00am MS+NC-MoM3 Invited Paper
Challenges and Opportunities for 32nm Node CMOS and Beyond
B. Doris, IBM Research at Albany Nanotech
10:20am MS+NC-MoM7
Multi Level “Air Gap” Integration for Advanced Technology Nodes
F. Gaillard, D. Bouchu, CEA-Leti-MINATEC, France, R. Gras, STMicroelectronics, France, S. Moreau, CEA-Leti-MINATEC, France, G. Passemard, J. Torres, STMicroelectronics, France
10:40am MS+NC-MoM8
Chemical Vapor Deposition of Manganese Self-Aligned Diffusion Barriers for Copper Interconnections in Microelectronics
H. Kim, Y. Au, H. Wang, H. Bhandari, Y. Liu, Harvard University, D.K. Lee, Samsung, Y. Lin, R.G. Gordon, Harvard University
11:00am MS+NC-MoM9 Invited Paper
What Photoemission Can Tell Us About High-K Dielectrics
R.L. Opila, G. Liu, University of Delaware
11:40am MS+NC-MoM11
Influence of Room Temperature Control System on AFM Imaging
J. Fu, National Institute of Standards and Technology, W. Chu, Harbin Institute of Technology, China, T. Vorburger, National Institute of Standards and Technology