AVS 66th International Symposium & Exhibition
    Plasma Science and Technology Division Monday Sessions

Session PS2-MoM
Plasma Modeling

Monday, October 21, 2019, 8:20 am, Room B130
Moderators: Mingmei Wang, TEL Technology Center, America, LLC, Nathan Marchack, IBM T.J. Watson Research Center


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  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

8:20am PS2-MoM1
Computational Modeling of Capacitively Coupled Plasmas at Moderate Pressures in gases of Argon, Helium and Nitrogen
Wei Tian, Applied Materials, D. Peterson, S.C. Shannon, North Carolina State University, S. Rauf, Applied Materials
8:40am PS2-MoM2
Relation between Atomic Interaction Parameters of a Surface Material and its Physical Sputtering Yield; How to Predict the Etching Rate based on the Surface Material Properties
Nicolas Mauchamp, M. Isobe, S. Hamaguchi, Osaka University, Japan
9:00am PS2-MoM3 Invited Paper
Investigation on the Uniformity Control of the Electron and the Ion Kinetics in a Capacitively Coupled Plasma Reactor using a Parallelized Particle-in-Cell Simulation
Hae June Lee, Pusan National University, Republic of Korea, H.J. Kim, Dong A Uiversity, Republic of Korea, J.S. Kim, Tokyo Electron Technology Solutions Limited, Japan
9:40am PS2-MoM5
Capacitively Coupled Plasma Uniformity Improvement Using Phase and Amplitude Control of Electrode Potential
Xiaopu Li, K. Bera, S. Rauf, Applied Materials
10:00am PS2-MoM6
Kinetic Modeling of Non-Equilibrium Plasmas for Modern Applications
Igor Kaganovich, A. Khrabrov, A. Powis, Princeton Plasma Physics Laboratory
10:40am PS2-MoM8
Automated Reduction of Plasma Chemistry Sets
Sebastian Mohr, Quantemol Ltd., UK, M. Hanicinec, University College London, UK, A. Dzarasova, Quantemol Ltd., UK, J. Tennyson, University College London, UK
11:00am PS2-MoM9
Prediction of Etch Rates for New Materials by Machine Learning - Case Study for Physical Sputtering
Kazumasa Ikuse, Osaka University, Japan, H. Kino, National Institute for Materials Science (NIMS), Japan, S. Hamaguchi, Osaka University, Japan
11:20am PS2-MoM10
Maskless and Contactless Patterned Silicon Deposition using a Localized PECVD Process
Ronan Leal, B. Bruneau, P. Bulkin, T. Novikova, F. Silva, LPICM, CNRS, Ecole Polytechnique, Institut Polytechnique de Paris, France, N. Habka, TOTAL GRP - New Energies, France, E.V. Johnson, LPICM, CNRS, Ecole Polytechnique, Institut Polytechnique de Paris, France