AVS 65th International Symposium & Exhibition
    Thin Films Division Tuesday Sessions

Session TF+PS-TuA
Atomic Layer Processing: Chemistry & Surface Reactions for Atomic Layer Processing

Tuesday, October 23, 2018, 2:20 pm, Room 104B
Moderators: Jessica Kachian, Intel Corporation, Keren Kanarik, Lam Research Corporation


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  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

2:20pm TF+PS-TuA1 Invited Paper
N-heterocyclic Carbenes on Au and Cu Surfaces
Cathleen Crudden, Queen's University, Canada
3:00pm TF+PS-TuA3
Enhancing Nucleation in Platinum Atomic Layer Deposition by Surface Pre-Treatment with Small Organometallic Molecules
Camila de Paula, L. Zeng, S.F. Bent, Stanford University
3:20pm TF+PS-TuA4
Mass Spectrometer Studies of Volatile Etch Products Produced by Ligand-Exchange Reactions During Thermal Atomic Layer Etching
Joel Clancey, A.S. Cavanagh, S.M. George, University of Colorado Boulder
5:00pm TF+PS-TuA9
Calculations of Etch Products from Thermal Atomic Layer Etching Using Fluorination and Ligand-Exchange Reactions
Andrew Cavanagh, J.W. Clancey, S. Sharma, S.M. George, University of Colorado at Boulder
5:20pm TF+PS-TuA10
Formation of Monolayers and Multilayers During the Vapor-Phase Deposition of Dodecanethiols on Copper Oxide
David Bergsman, T-L. Liu, R.G. Closser, S.F. Bent, Stanford University
5:40pm TF+PS-TuA11
Exchange Reactions During Atomic Layer Deposition: ZnO Conversion to Al2O3 by Trimethylaluminum
Tyler Myers, A.M. Cano, J.W. Clancey, D.K. Lancaster, S.M. George, University of Colorado at Boulder
6:00pm TF+PS-TuA12
3D Feature Profile Simulation Coupled with Realistic Plasma Surface Reaction Model for ALE Process
Y.H. Im, YeongGeun Yook, H.S. You, J.H. Park, Chonbuk National University, Republic of Korea, D.H. You, KW Tech, Republic of Korea, K.S. Choi, Chonbuk National University, Republic of Korea, W.S. Chang, National Fusion Research Institute, Republic of Korea