| AVS 65th International Symposium & Exhibition | |
| MEMS and NEMS Group | Thursday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| MN-ThP1 The Ni-Co Micro-porous Array with High Dimensional Accuracy Control by Electroforming Process YuHsin Lin, H.J. Wen, ITRC,NARL, Taiwan, Republic of China, C.J. Tsia, NCTU, Taiwan, Republic of China, M.-K. Wang, N.N. Chu, C.C. Chen, C.-N. Hsiao, ITRC,NARL, Taiwan, Republic of China |
| MN-ThP2 Reactive Etching of AlGaN using BCl3 and Ar/BCl3 Meng-Kun Wang, Y.-H. Lin, C.-N. Hsiao, C.C. Chen, J.S. Su, N.C. Chu, C.-T. Lee, ITRC,NARL, Taiwan, Republic of China |
| MN-ThP4 III-V_Si Wafer Bonding using Silicon Oxide Interlayer WoongSun Lim, S.H. Jung, Korea Advanced Nano Fab Center, Republic of Korea, S.Y. Hwang, Korea Advancnced Nano Fab Center, Republic of Korea, G.Y. Yeom, Sungkyunkwan University, Republic of Korea |
| MN-ThP5 Flexible Nanocomposite Sensors for Biomedical and Energy Harvesting Applications A.K. Batra, Bir Bohara, Alabama A&M University, R. Currie, NASA |
| MN-ThP6 Comparative Studies of Electrical Behavior of PLZT Thin Film Capacitors using Coplanar and Interplanar Configurations Vaishali Batra, R. Paul, S. Kotru, The University of Alabama |