AVS 65th International Symposium & Exhibition
    MEMS and NEMS Group Thursday Sessions
       Session MN-ThP

Paper MN-ThP2
Reactive Etching of AlGaN using BCl3 and Ar/BCl3

Thursday, October 25, 2018, 6:00 pm, Room Hall B

Session: MEMS and NEMS Group Poster Session
Presenter: Meng-Kun Wang, ITRC,NARL, Taiwan, Republic of China
Authors: M.-K. Wang, ITRC,NARL, Taiwan, Republic of China
Y.-H. Lin, ITRC,NARL, Taiwan, Republic of China
C.-N. Hsiao, ITRC,NARL, Taiwan, Republic of China
C.C. Chen, ITRC,NARL, Taiwan, Republic of China
J.S. Su, ITRC,NARL, Taiwan, Republic of China
N.C. Chu, ITRC,NARL, Taiwan, Republic of China
C.-T. Lee, ITRC,NARL, Taiwan, Republic of China
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In this paper, we study the self- limited reaction of Ar/BCl3 and AlGaN. We performed AlGaN surface oxidation reaction with oxygen ions before Ar/BCl3 etching on the AlGaN surface, and used the same power of inductively coupled plasma (ICP), the same working pressure, and the same The etching time was compared to the difference in etching rate of AlGaN between Ar/BCl3 and BCl3. And using Atomic force microscopy (AFM) and scanning electron microscopy (SEM) to observe the change and morphology of the surface roughness after etching. The results show that the mixed gas of Ar/BCl3 has a faster etching rate, the etching rate is about 4.79 nm/min, and the etching rate of BCl3 gas is slow, and the etching rate is about 0.90 nm/min.