AVS 65th International Symposium & Exhibition | |
MEMS and NEMS Group | Thursday Sessions |
Session MN-ThP |
Session: | MEMS and NEMS Group Poster Session |
Presenter: | YuHsin Lin, ITRC,NARL, Taiwan, Republic of China |
Authors: | Y.-H. Lin, ITRC,NARL, Taiwan, Republic of China H.J. Wen, ITRC,NARL, Taiwan, Republic of China C.J. Tsia, NCTU, Taiwan, Republic of China M.-K. Wang, ITRC,NARL, Taiwan, Republic of China N.N. Chu, ITRC,NARL, Taiwan, Republic of China C.C. Chen, ITRC,NARL, Taiwan, Republic of China C.-N. Hsiao, ITRC,NARL, Taiwan, Republic of China |
Correspondent: | Click to Email |
In this project, the Ni-Co micro-porous array membrane for ultra-high sensitivity gas detector for nano particle distribution measurement is developed for cascade impactor application. The thick film lithography and electroforming technologies have been integrated, here. The dimension of micro-porous can be precisely controlled and reproducible. Finally, the micro-porous metal film will be integrated with base structure by laser welding technology. The component is used for cascade impactor equipment.
The fabrication process of Ni-Co micro-porous array membrane is used MEMS process. Here, the 6 inch silicon wafer as a substrate is used. The Cr/Au with 30/200nm thickness as a seedlayer is made by Sputter. The gold has good electrical conductivity to get well Ni-Co thickness uniformity at electroforming process. The AZ6112 photoresist is patterned on the seedlayer by lithography. The Cr/Au is etched to define a circle pattern. Then the thick photoresist SU8 pillar with 150µm thickness is fabricated at the center of the circle seedlayer pattern. The diameter of SU8 at the bottom is used to control the final diameter of Ni-Co porous. The Ni-Co membrane with 130µm thickness has been fabricated by electroforming process. Finally, the SU8 pillar is removed and the Ni-Co porous membrane is peel off from substrate. The Ni-Co micro-porous array membrane with good hole’s dimension control have successful fabricated.
Keywords: Micro-porous, Electroforming, cascade impactor
Acknowledgements: This work was sponsored in part by the Ministry of Science and Technology Taiwan under contract number MOST 106-2622-E-492 -024 -CC3 and 106-2622-E-492-004 -CC3.