| AVS 63rd International Symposium & Exhibition | |
| Thin Film | Wednesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 2:20pm | TF+EM+MI-WeA1 Impact of ALD VO2 Film Thickness on the Electrical and Optical Properties of the Metal-Insulator Phase Transition Virginia Wheeler, B.P. Downey, J. Roussos, M. Currie, A. Giles, C. Ellis, J. Tischler, J. Caldwell, D.J. Meyer, C.R. Eddy, Jr., U.S. Naval Research Laboratory |
| 2:40pm | TF+EM+MI-WeA2 Study of Ru Silicidation with and without Sub-nm ALD TiN and TaN Barrier/nucleation Layers for Ru Interconnect Applications Sonal Dey, SUNY College of Nanoscale Science and Engineering, K.-H. Yu, S. Consiglio, K. Tapily, C.S. Wajda, G.J. Leusink, TEL Technology Center, America, LLC, J. Jordan-Sweet, C. Lavoie, IBM T.J. Watson Research Center, A.C. Diebold, SUNY College of Nanoscale Science and Engineering |
| 3:00pm | TF+EM+MI-WeA3 Invited Paper 2D - Material and Process Challenges of the Ultimate Thin Films in Nanoelectronics Stefan de Gendt, KU Leuven, IMEC, Belgium, S. Brems, D. Chiape, IMEC, Belgium, M. Heyne, K. Verguts, KU Leuven, IMEC, Belgium, R. Philipson, KU Leuven, Belgium, C. Lockhart de la Rosa, A. Delabie, KU Leuven, IMEC, Belgium, S. De Feyter, KU Leuven, Belgium, C. Huyghebaert, IMEC, Belgium |
| 4:40pm | TF+EM+MI-WeA8 Atomic Layer Deposition of Stoichiometric TaSi2 on Si(001) A.C. Kummel, JongYoun Choi, S.W. Park, University of California San Diego, R. Hung, Applied Materials Inc. |
| 5:00pm | TF+EM+MI-WeA9 Different Approaches for Enhancing the Thermal Stability of Ge2Sb2Te5 Thin Films by Carbon Addition David Adams, K. Childs, T. Gurrieri, W. Rice, Sandia National Laboratories |
| 5:20pm | TF+EM+MI-WeA10 Comparison of Electromigration and Resistivity in On-chip Co and Cu Damascene Nanowires C.-K. Hu, J. Kelly, J.H-C. Chen, H. Huang, Y. Ostrovski, R. Patlolla, B. Peethala, P. Adusumilli, T. Spooner, IBM Research Division, Albany, L. Gignac, S. Cohen, IBM Research Division, T.J. Watson Research Center, R. Long, G. Hornicek, T. Kane, G. Lian, M. Ali, IBM Systems, V.M. Kamineni, F. Mont, S. Siddiqui, GLOBALFOUNDRIES |
| 5:40pm | TF+EM+MI-WeA11 UV/VUV Curing Process for Low-k Organosilicate Dielectrics Huifeng Zheng, X. Guo, D. Pei, W. Li, J. Blatz, K. Hsu, D. Benjamin, University of Wisconsin-Madison, Y. Lin, H. Fung, C. Chen, National Synchrotron Radiation Research Center, Taiwan, Republic of China, Y. Nishi, Stanford University, J.L. Shohet, University of Wisconsin-Madison |
| 6:00pm | TF+EM+MI-WeA12 Effects of Cesium Ion Implantation on the Mechanical and Electrical Properties of Organosilicate Low-k Films Weiyi Li, D. Pei, X. Guo, M.-K. Cheng, S. Lee, University of Wisconsin-Madison, Q. Lin, IBM Research Division, T.J. Watson Research Center, S.W. King, Intel Corporation, J.L. Shohet, University of Wisconsin-Madison |