AVS 63rd International Symposium & Exhibition
    Thin Film Wednesday Sessions
       Session TF+EM+MI-WeA

Invited Paper TF+EM+MI-WeA3
2D - Material and Process Challenges of the Ultimate Thin Films in Nanoelectronics

Wednesday, November 9, 2016, 3:00 pm, Room 105A

Session: Thin Films for Microelectronics
Presenter: Stefan de Gendt, KU Leuven, IMEC, Belgium
Authors: S. de Gendt, KU Leuven, IMEC, Belgium
S. Brems, IMEC, Belgium
D. Chiape, IMEC, Belgium
M. Heyne, KU Leuven, IMEC, Belgium
K. Verguts, KU Leuven, IMEC, Belgium
R. Philipson, KU Leuven, Belgium
C. Lockhart de la Rosa, KU Leuven, IMEC, Belgium
A. Delabie, KU Leuven, IMEC, Belgium
S. De Feyter, KU Leuven, Belgium
C. Huyghebaert, IMEC, Belgium
Correspondent: Click to Email

Graphene has emerged as one of the promising candidates for post-Si electronics, both for channel (Logic, RF, sensors) and interconnect applications. Further, other two-dimensional (2D) materials such as transition metal dichalcogenides (MX2, with M a transition metal of group 4–7 and X a chalcogen) have versatile properties that complement or even supersede those of graphene. Both categories however share similar problems, related to the absence of good quality synthesis processes, subsequent layer transfer processes and doping and contacting challenges. To tackle the first challenge – growth – chemical vapor deposition (CVD) is widely considered to be the most economically viable method to produce both graphene and MX2 materials for high-end applications. However, in most cases, this deposition technique typically yields undesired grain boundaries in the 2D crystals, which drastically increases the sheet resistance of the layer. Strategies w.r.t. template and process development will be presented. Further, given growth temperature and template, direct growth on devices is often unfeasible, thus a second challenge relates to the requirement for a transfer process. For graphene, several transfer process possibilities have been evaluated, but up to now, the graphene transfer suffers from contamination often coming from the temporary support layer and/or etching products, wrinkle formation during bonding, crack formation during graphene handling, ... Moreover, with improvement in 2D quality the release from the growth template is hindered due to increased adhesion forces. At least for MX2 materials, the transfer challenge can be avoided through area selective growth. A process based on a reductive two step CVD process will be presented, whereby in a first step the metal precursor (WF6) is reduced to a lower oxidation state through sacrificial reaction with Si. Subsequently, the metallic film is allowed to react with a sulphur precursor (H2S). Challenges are again related to the (poly)crystallinity of the films and the control of lateral 2D versus crystal 3D growth. Last but not least, a third challenge related to 2D materials resides in the contacting and doping of these materials. Different strategies have been proposed to achieve doping, but in this presentation we will demonstrate the self-assembly of organic molecules physisorbed on top bulk and thin 2D layers as a means to achieve controlled doping.