| AVS 62nd International Symposium & Exhibition | |
| Plasma Science and Technology | Wednesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 2:20pm | PS+AS+SS-WeA1 In Situ FTIR Diagnostics and Characterization of Etch By-Product Deposition on Chamber Walls and Wafer Surface during Halogen Etching of Silicon Neema Rastgar, S. Sriraman, R. Marsh, A. Paterson, Lam Research Corporation |
| 2:40pm | PS+AS+SS-WeA2 Particle as a Temperature Probe: Thermal Effects in Non-Thermal Plasmas Thomas Lopez, L. Mangolini, University of California Riverside |
| 3:00pm | PS+AS+SS-WeA3 Invited Paper Plasma-Surface Interactions at Low and High Pressure Vincent Donnelly, University of Houston |
| 4:20pm | PS+AS+SS-WeA7 Measurements of IIEE Emitted Electrons from Chemically-Cleaned and Sputtered-Cleaned Semiconductor Surfaces D. Urrabazo, Lawrence Overzet, University of Texas at Dallas |
| 4:40pm | PS+AS+SS-WeA8 Effects of Hydrogen on Etching Processes for Transparent Conducting Films Hu Li, K. Karahashi, Osaka University, Japan, M. Fukasawa, K. Nagahata, T. Tatsumi, Sony Corporation, Japan, S. Hamaguchi, Osaka University, Japan |
| 5:00pm | PS+AS+SS-WeA9 Mechanisms of Hydrocarbon Based Polymer Etch using Pulsed Plasmas Barton Lane, P. Ventzek, M. Matsukuma, A. Suzuki, A. Koshiishi, Tokyo Electron Limited |
| 5:20pm | PS+AS+SS-WeA10 Role of Plasma Density in Damage Characterization and its Impact on Low-Damage Plasma Process Design Koji Eriguchi, M. Kamei, Y. Nakakubo, K. Ono, Kyoto University, Japan |
| 5:40pm | PS+AS+SS-WeA11 Dry Deep Etching Of Bulk Titanium By Plasma Processes Edouard Laudrel, T. Tillocher, P. Lefaucheux, GREMI CNRS/Université d'Orléans, France, B. Boutaud, Sorin Crm, France, R. Dussart, GREMI CNRS/Université d'Orléans, France |
| 6:00pm | PS+AS+SS-WeA12 Particle Transport with Wafer Potential Controlled by Dipole Electrostatic Chuck Electrodes Masaki Ishiguro, M. Sumiya, Hitachi High-Technologies Corp., Japan |