AVS 62nd International Symposium & Exhibition
    Materials Characterization in the Semiconductor Industry Focus Topic Tuesday Sessions

Session MC-TuM
Characterization of 3D structures

Tuesday, October 20, 2015, 8:00 am, Room 114
Moderator: Paul van der Heide, GLOBALFOUNDRIES, Inc.


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  in Adobe Acrobat format  

Click a paper to see the details. Presenters are shown in bold type.

8:00am MC-TuM1 Invited Paper
Expanding Roles of Materials Characterization and Metrology in Advancing Moore's Law
Z. Ma, Ying Zhou, Intel Corporation
8:40am MC-TuM3
X-ray based Characterization of Strained SiGe on FinFETs
Kriti Kohli, M.A. Smith, A. Madan, Z. Zhu, J.R. Holt, GLOBALFOUNDRIES, M. Klare, Revera
9:00am MC-TuM4
Atomic Scale Analysis by Atom Probe on 3D Semiconductor Structures
Ajay Kumar Kambham, S. Shintri, D. Flatoff, P. van der Heide, Globalfoundries
9:20am MC-TuM5 Invited Paper
Preparing and Characterizing Nanoscale Topological Insulators
Kenneth Burch, Boston College
11:00am MC-TuM10
”More than Moore”: Could Silicene Be the Future of Electronics?
J. Avila, Ch. Chen, S. Lorcy, Maria Asensio, Synchrotron SOLEIL, France
11:20am MC-TuM11
Challenges in Measuring Strain in Nanoscale 3D FinFET Structures
Anita Madan, GLOBALFOUNDRIES, S. Mochozuki, IBM Albany Nanotech Center, C. Murray, IBM, T. J. Watson Research Center, D. Cooper, CEA, LETI, MINATEC Campus, France, Y. Wang, W. Weng, T. Pinto, GLOBALFOUNDRIES
11:40am MC-TuM12 Invited Paper
Strain Measurement using Electron Beam Techniques
Jean-Luc Rouviere, CEA-University Grenoble Alps, France, N. Bernier, CEA, LETI, MINATEC Campus, France, D. Cooper, CEA-LETI, France