| AVS 61st International Symposium & Exhibition | |
| Thin Film | Monday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 9:00am | TF+PS+SE-MoM3 Ternary and Quaternary Thin Layers Deposited by Magnetron Sputtering Marie-Paule Besland, J. Tranchant, E. Janod, C. Benoit, L. Cario, P.Y. Jouan, M. Carette, A. Lafond, Institut des Matériaux Jean Rouxel – Université de Nantes, France, R. Meunier, S. Fabert, Institut des Matériaux Jean Rouxel – Université de Nantes and Crosslux, France, P.Y. Thoulon, M. Ricci, Crosslux Company, France |
| 9:20am | TF+PS+SE-MoM4 Molecular Dynamics Simulations of TiN/TiN(001) Growth Daniel Edström, D.G. Sangiovanni, V. Chirita, L. Hultman, Linköping University, Sweden, I.G. Petrov, J.E. Greene, University of Illinois at Urbana Champaign |
| 9:40am | TF+PS+SE-MoM5 Surface Chemistry of Pd and Ag Interaction with 3C-SiC Thin Films Deposited on Si(111) by Pulsed Laser Depositon Rachel Seibert, D. Velazquez, J. Terry, Illinois Institute of Technology, K.A. Terrani, C. Baldwin, F. Montgomery, K. Leonard, J. Hunn, P. Schuck, R. Stoller, Oak Ridge National Laboratory, S. Saddow, University of South Florida |
| 10:00am | TF+PS+SE-MoM6 High Thermal Stability Nanocrystalline Gold, Part I Ronald Goeke, N. Argibay, J.E. Mogonye, K.M. Hattar, S.V. Prasad, Sandia National Laboratories |
| 10:40am | TF+PS+SE-MoM8 High Thermal Stability Nanocrystalline Gold Thin Films, Part II Nicolas Argibay, J.E. Mogonye, R.S. Goeke, K.M. Hattar, M.T. Dugger, S.V. Prasad, Sandia National Laboratories |
| 11:00am | TF+PS+SE-MoM9 Growth and Phase Stability of Zirconium Diboride Thin Films David Stewart, D.J. Frankel, R.J. Lad, University of Maine |
| 11:20am | TF+PS+SE-MoM10 Thickness Dependence of High Frequency Magnetic Properties for Thin Films of Iron-Gallium-Boron Colin Rementer, Y. Kim, J.P. Chang, University of California at Los Angeles |
| 11:40am | TF+PS+SE-MoM11 Optimizing Magnetic Confinement for High Productivity PVD System Linear Scanning Magnetron V. Kudriavtsev, Robert Norris, T. Bluck, I. Latchford, Intevac, Inc. |