| AVS 60th International Symposium and Exhibition | |
| Thin Film | Wednesday Sessions |
Click a paper to see the details. Presenters are shown in bold type.
| 8:00am | TF+VT-WeM1 Tuning the Composition and Water Vapor Permeation Properties of the Silica-Like Films Deposited in Atmospheric Pressure High Current Dielectric Barrier Discharge S.A. Starostin, H. de Vries, FUJIFILM Manufacturing Europe B.V, Netherlands, M. Creatore, Eindhoven University of Technology, Netherlands, M.C.M. van de Sanden, Dutch Institute for Fundamental Energy Research (DIFFER), Netherlands |
| 8:20am | TF+VT-WeM2 Measuring the Diffusion Coefficient of Water in High Quality Permeation Barrier Layers B. Visweswaran, Princeton University, P. Mandlik, J. Silvernail, R. Ma, Universal Display Corporation, J.C. Sturm, S. Wagner, Princeton University |
| 8:40am | TF+VT-WeM3 Invited Paper Improving the Reliability of Electronics Using ALD Barrier Films S. Graham, H. Kim, A. Sharma, D. Samet, A. Bulusu, Georgia Institute of Technology |
| 9:20am | TF+VT-WeM5 Long-term Performance of Atomic Layer Deposited Al2O3 and Parylene Bi-layer Encapsulation for Utah Electrode Array Based Neural Interfaces X. Xie, L.W. Rieth, F. Solzbacher, University of Utah |
| 9:40am | TF+VT-WeM6 On the Role of Nanoporosity in Moisture Permeation Barrier Layers A. Perrotta, G. Aresta, W. Keuning, Eindhoven University of Technology, Netherlands, M.C.M. van de Sanden, Eindhoven University of Technology; DIFFER, Netherlands, W.M.M. Kessels, M. Creatore, Eindhoven University of Technology, Netherlands |
| 10:40am | TF+VT-WeM9 Atomic Density and Nano-Porosity Thresholds for Nanoscale Low-k Moisture Diffusion Barrier Materials S.W. King, E. Mays, J.D. Bielefeld, D. Jacob, B. Colvin, D. Vanleuven, J. Kelly, Intel Corporation, M. Liu, D. Dutta, D. Gidley, University of Michigan |
| 11:20am | TF+VT-WeM11 Low Stress Carbon Films as Gas Barrier Layers J. Rowley, R.C. Davis, L. Pei, R.R. Vanfleet, Brigham Young University, S. Liddiard, M. Harker, J. Abbott, MOXTEK Incorporated |
| 11:40am | TF+VT-WeM12 The Effective Control of Surface Profile and Arc Discharge during Amorphous Carbon Layer Deposition Process I.-S. Kim, J. Park, J.H. Lee, M.J. Kim, Y.B. Choi, H.-G. Kim, S.H. Lee, J.W. Hong, J.L. Lee, M.W. Kim, G. Choi, H.-K. Kang, E.S. Jung, Samsung Electronics Co., LTD., South Korea |